A kind of miniature LED light-emitting device and preparation method thereof
A light-emitting device, miniature technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problem that the size and thickness of the package carrier cannot be further reduced, the difficulty of optimizing the pixel pitch of the display screen, and the three-color LED device. The package volume cannot be further reduced to achieve the effect of improving yield and reliability, preventing light leakage and improving reliability
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Embodiment 1
[0053] see figure 1 and figure 2 , a micro-LED light-emitting device, including an RGB chipset, a conductive contactor, a coating and a protective layer 5, the RGB chipset includes a parallel R chip 201, a B chip 202 and a G chip 203, and the conductive contactor It consists of a first conductive contact 101 with a length of 300 μm and a width of 70 μm, and a second conductive contact 102, a third conductive contact 103, and a fourth conductive contact 104 arranged side by side with a length of 70 μm and a width of 80 μm. The RGB The chipset is electrically connected to the conductive contactor. The R chip 201, the G chip 202 and the B chip 203 are all flip-chip structures, and the N poles are all fixed on the first conductive contactor. The P pole of the R chip 201 Fixed on the second conductive contactor 102, the P pole of the G chip 202 is fixed on the third conductive contactor 103, the P pole of the B chip 203 is fixed on the fourth conductive contactor 104, and the cov...
Embodiment 2
[0078] see Figure 4 and Figure 5 , a micro-LED light-emitting device, including an RGB chipset, a conductive contactor, a coating and a protective layer 5, the RGB chipset includes a parallel R chip 201, a B chip 202 and a G chip 203, and the conductive contactor It consists of a first conductive contact 101 with a length of 380 μm and a width of 160 μm, and a second conductive contact 102, a third conductive contact 103, and a fourth conductive contact 104 arranged side by side with a length of 160 μm and a width of 120 μm. The RGB The chip set is electrically connected to the conductive contactor, the R chip 201, the G chip 202 and the B chip 203 are all vertical structures, and the P poles are all fixed on the first conductive contactor, and the N pole of the R chip 201 passes through The gold wire is connected with the second conductive contactor 102, the N pole of the G chip 202 is connected with the third conductive contactor 103 through the gold wire, and the N pole ...
Embodiment 3
[0103] see figure 1 and figure 2 , a micro-LED light-emitting device, including an RGB chipset, a conductive contactor, a coating and a protective layer 5, the RGB chipset includes a parallel R chip 201, a B chip 202 and a G chip 203, and the conductive contactor It consists of a first conductive contact 101 with a length of 360 μm and a width of 140 μm, and a second conductive contact 102, a third conductive contact 103, and a fourth conductive contact 104 arranged side by side with a length of 140 μm and a width of 100 μm. The RGB The chipset is electrically connected to the conductive contactor, the R chip 201, the G chip 202 and the B chip 203 are all flip-chip structures, and the P poles are all fixed on the first conductive contactor, and the N pole of the R chip 201 fixed on the second conductive contactor 102, the N pole of the G chip 202 is fixed on the third conductive contactor 103, the N pole of the B chip 203 is fixed on the fourth conductive contactor 104, and ...
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