LCP-FPC multi-layer pre-fixation board and combination pre-fixation process thereof
A technology of LCP-FPC and pre-fixed board, which is applied in the direction of multi-layer circuit manufacturing, conductive pattern layout details, printed circuit components, etc. It can solve the problems of misalignment between layers, weak fixation, low melt viscosity, etc., and achieve the solution of combination force difference effect
Pending Publication Date: 2020-02-07
ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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Problems solved by technology
[0003] Conventional FPC multilayer boards use FCCL copper-clad laminate base material + ordinary acrylic or epoxy resin film as the interlayer adhesive. The film has a better affinity with the substrate medium layer and copper foil. Pre-fixation can achieve a certain bonding force; when using LCP substrates as FPC multilayer boards, the interlayer adhesion depends on the LCP resin of the LCP substrate itself, and the melting temperature of the LCP resin is above 300 ° C, and the melt viscosity Very low, it is difficult to bond when pre-fixed with a common flat-tip soldering iron, resulting in weak fixation and prone to misalignment between layers
Method used
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[0018] Such as figure 1 and figure 2 As shown, in this embodiment, the LCP-FPC multilayer pre-consolidated board includes a single-sided panel F1 and a double-sided panel F2; the single-sided panel F1 includes a top copper foil A1 and a first LCP dielectric layer B1, and the top surface The copper foil A1 is arranged on the first LCP dielectric layer B1; the double-sided board F2 includes an inner circuit layer A2, a second LCP dielectric layer B2 and a bottom copper foil A3, and the inner circuit layer A2 and the bottom surface The copper foil A3 is located on and below the second LCP dielectric layer B2 respectively; the first LCP dielectric layer B1 is attached to the top of the inner circuit layer A2, and the scrap side of the inner circuit layer A2 There are several hollowed-out areas C of copper skin.
[0019] In this embodiment, the inner circuit layer A2 is square, and each side of the inner circuit layer A2 is provided with three hollowed-out regions C of the coppe...
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Abstract
The invention discloses and provides an LCP-FPC multilayer pre-fixation board and a combination pre-fixation process thereof, which can effectively solve the problem of poor spot-ironing pre-fixationbinding force after combination of LCP-FPC multilayer boards to make the production smoothly carried out. The LCP-FPC multilayer pre-fixation board comprises a single-sided board and a double-sided board. The single-sided board comprises a top surface copper foil and a first LCP dielectric layer, wherein the top surface copper foil is arranged on the first LCP dielectric layer. The double-sided board comprises an inner circuit layer, a second LCP dielectric layer and a bottom copper foil, wherein the inner circuit layer and the bottom copper foil are located on the upper surface and the lowersurface of the second LCP dielectric layer respectively; the first LCP dielectric layer is attached to the upper surface of the inner circuit layer; and a plurality of copper sheet hollowed-out areasare arranged on the waste edge of the inner circuit layer. The method is applied to the technical field of LCP-FPC multilayer board combination pre-fixation.
Description
technical field [0001] The invention relates to an LCP-FPC multi-layer board combined pre-fixing technology, in particular to an LCP-FPC multi-layer pre-fixed board and its combined pre-fixing process. Background technique [0002] The combination of FPC multi-layer boards needs to combine more than two FPC single-sided or double-sided boards through adhesive films, and use an electric soldering iron to pre-fix them so that the layers are bonded together to prevent the gap between the layers before pressure transmission. Misalignment occurs. [0003] Conventional FPC multilayer boards use FCCL copper-clad laminate base material + ordinary acrylic or epoxy resin film as the interlayer adhesive. The film has a better affinity with the substrate medium layer and copper foil. Pre-fixation can achieve a certain bonding force; when using LCP substrates as FPC multilayer boards, the interlayer adhesion depends on the LCP resin of the LCP substrate itself, and the melting temperatu...
Claims
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IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/4638
Inventor 陈浪何波黄志刚刘志勇林均秀
Owner ZHUHAI YUANSHENG ELECTRONICS SCI & TECH