Adjusting device for wire passing wheel of wire cutting machine

An adjusting device and a wire-passing wheel technology, applied in the field of silicon wafer manufacturing, can solve the problems of short travel of the wire-passing wheel, inaccurate adjustment of the wire-passing wheel angle, and vibration of the steel wire on the wire-passing wheel, so as to reduce shaking and steel wire. Line jitter, the effect of increasing friction
CN110774465APending Publication Date: 2020-02-11晶海洋半导体材料(东海)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
晶海洋半导体材料(东海)有限公司
Publication Date
2020-02-11

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Abstract

The invention provides an adjusting device for a wire passing wheel of a wire cutting machine. The adjusting device comprises a long-bar-shaped sliding rail which is transversely arranged, a transverse moving sliding block and a fastening mechanism. The transverse moving sliding block is arranged on the long-bar-shaped sliding rail in a sleeving manner and can slide along the long-bar-shaped sliding rail. A threaded hole is formed in one side of the transverse moving sliding block, and the transverse moving sliding block is used for driving the wire passing wheel to move along the long-bar-shaped sliding rail. The fastening mechanism comprises a bolt and a pressing block, the pressing block is provided with a clamping groove matched with the outer side surface of the long-bar-shaped sliding rail, the bolt is screwed in the threaded hole of the transverse moving sliding block, one end of the bolt penetrates out of the transverse moving sliding block and is connected with the pressing block so that the pressing block can abut against the long-bar-shaped sliding rail, and the surface of at least one side of the clamping groove of the pressing block is in a rectangular shape. By meansof the adjusting device for the wire passing wheel of the wire cutting machine, the adjusting stability of the wire passing wheel can be improved, and free and fast moving, adjusting and positioning of the wire passing wheel are ensured, and the production efficiency is improved.
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Description

technical field

[0001] The invention relates to the field of silicon wafer manufacturing, in particular to a wire cutter adjusting device for a wire passing wheel. Background technique

[0002] In recent years, the traditional mortar cutting in the silicon wafer cutting industry has been gradually replaced by diamond wire cutting, and the diameter of its main cutting auxiliary material, gold steel wire, has gradually decreased from 70 microns to 50 microns or even finer. higher requirements.

[0003] The existing wire cutting machine thread wheel adjustment device has the following problems during use:

[0004] 1) The shaking of the steel wire on the wire wheel;

[0005] 2) The angle adjustment of the thread wheel is not accurate;

[0006] 3) The stroke of the thread wheel is too short. Contents of the invention

[0007] In view of this, the present invention provides a wire-passing wheel adjustment device for a wire cutting machine to solve the problems of wire shakin...

Claims

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