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Optical module, method, device and system for obtaining optical signal, and storage medium

An optical module and optical signal technology, applied in the field of communication, can solve the problems of complex packaging, poor integration of silicon optics, poor versatility, etc., and achieve the effect of reducing packaging complexity and reducing heat dissipation

Inactive Publication Date: 2020-02-14
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Embodiments of the present invention provide an optical module, a method for obtaining an optical signal, a device, a system, a storage medium, and an electronic device, so as to at least solve the problems of the optical transceiver module in the related art, such as the inability to share light sources, poor versatility, and complicated packaging. At least one of the problems with poor integration with silicon photonics

Method used

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  • Optical module, method, device and system for obtaining optical signal, and storage medium
  • Optical module, method, device and system for obtaining optical signal, and storage medium
  • Optical module, method, device and system for obtaining optical signal, and storage medium

Examples

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specific Embodiment 1

[0096] Such as Figure 7 As shown, the optical transceiver module is a single-channel dual-fiber bidirectional module, which contains a transmitting port 22 and a receiving port 23. In addition, it also includes an external optical input port 21. The external optical input port 21 is a single channel, and its connector Part of it is placed on the module housing, and is on a different optical connector from the transceiver optical interface of the module. The module housing 5 contains a light modulating component 1 , a light receiving component 3 , and a corresponding driving circuit 4 . The light modulation component includes an MZ modulator chip, and the modulator chip is mounted on the module main board. The modulator chip has an optical input interface 11 and an optical output interface 12, the optical output interface 12 of the modulator is connected to the emission optical interface 22 of the module, and the optical input interface 11 of the modulator is connected to the...

specific Embodiment 2

[0098] Such as Figure 8 As shown, the optical transceiver module includes a transmitting port 22 and a receiving port 23, and also includes an external optical input port 21. There is an integrated silicon optical chip 10 and a corresponding driving circuit 4 in the module housing 5, as shown in FIG. Figure 9 The shown integrated silicon photonics chip 10 integrates a multiplexer 101 , a light receiving component 102 and a power and wavelength splitter 103 , and there is no light source on the silicon photonics chip. The optical output interface 12 of the modulator is connected to the emitting optical interface 22 of the module, and the optical input interface 11 of the modulator is connected to the external light source input port 21 of the module. The difference from the second implementation example is that the module is a silicon optical module integrated with transceivers, and its external light source input port 21 is a multi-channel input port. Multiple external ligh...

specific Embodiment 3

[0100] Such as Figure 10 As shown, the optical transceiver module includes a transmitting port 22 and a receiving port 23 , and also includes an external optical input port 21 , and an integrated silicon photonics chip 10 and a corresponding driving circuit 4 are inside the module housing 5 . Such as Figure 11 As shown, the integrated silicon photonics chip 10 integrates an optical modulator 101 and an optical receiving component 102. The difference from the previous implementation examples is that the module’s transmitting port 22, receiving port 23 and external optical input port 21 are in the same MPO on the multi-core connector 20. This structure of arranging the external optical input port, the transmitting port and the receiving port of the module on the same connector saves space for the connector of the external optical input port. After the external light enters the silicon photonics chip from the external light source port 11 , it is modulated by the modulator 10...

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Abstract

The invention provides an optical module, a method, device and system for obtaining an optical signal, a storage medium and an electronic device. The optical module comprises an input port 202 and anoptical modulation assembly 204, and the input port 202 is configured to input light generated by an external light source located outside the optical module into the optical modulation assembly 204;the light modulation assembly 204 is configured to modulate light generated by an external light source to obtain a light signal. According to the invention, the problems of incapability of realizinglight source sharing, poor universality, complex packaging and poor integration with silicon light of an optical module in the prior art are solved.

Description

technical field [0001] The present invention relates to the communication field, in particular to an optical module, a method for obtaining an optical signal, a device, a system, a storage medium and an electronic device. Background technique [0002] The functional architecture of the optical transceiver module (also called an optical module) in the related art is as follows: figure 1 As shown, it consists of a light emitting component, a light receiving component, and a drive control circuit. These components and chips are packaged in SFP (Small Form-factor Pluggables, small form-factor pluggables), QSFP (Quad Small Form-factor Pluggables, four-channel SFP interface), CFP (Centum Form Factor Pluggable, 100G pluggable packages), etc. Inside the standard housing, a pluggable optical transceiver module is formed. The optical transmitting component in the optical transceiver module is the core component to complete the conversion of electrical signals to optical signals. It ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/40H04B10/516H04B10/572
CPCH04B10/40H04B10/516H04B10/572
Inventor 朱虎陈雷
Owner ZTE CORP