Thin antenna circuit board and manufacturing method thereof
An antenna circuit and manufacturing method technology, which is applied in the directions of printed circuit manufacturing, laminated printed circuit boards, printed circuits, etc., can solve the problems of reduced production efficiency, long time consumption, damage to the effect of glass fiber, etc., and achieves smooth surface and uniform thickness. Effect
Active Publication Date: 2021-03-23
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
However, due to the nature of the insulating base material itself, it often takes a long time to form the wire groove by laser cutting the insulating base material, resulting in a decrease in production efficiency, and the insulating base material in the above process cannot be a material containing glass fibers to avoid damage. The effect of the glass fibers on the insulating substrate
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[0051]The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0053] Some embodiments of the present invention will be descri...
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The invention discloses a thin antenna circuit board, which comprises N+1 conductive layers, N circuit layers and N insulating material layers, wherein N is a natural number; every two adjacent conductive layers are provided with an insulating material layer therebetween in a clamped manner, a circuit layer is buried in each insulating material layer, each circuit layer comprises at least one signal line and at least one connecting pad, each conductive layer is connected with the connecting pad adjacent to the conductive layer through at least one conductive structure arranged in the insulating material layer in a penetrating mode, and each conductive layer is directly formed on the surface of the insulating material layer through a metallization process.
Description
technical field [0001] The invention relates to a manufacturing method of a circuit board, in particular to a manufacturing method of a thin antenna circuit board. Background technique [0002] In recent years, electronic products have been widely used in daily work and life, and light, thin and small electronic products have become more and more popular. As the main component of electronic products, flexible circuit boards occupy a large space of electronic products. Therefore, the volume of flexible circuit boards greatly affects the volume of electronic products. Large-volume flexible circuit boards are bound to be difficult to meet the light weight of electronic products. , thin, short, small trend. [0003] By embedding the electronic components (such as resistors, capacitors, circuits, etc.) of the flexible circuit board inside the circuit substrate, it is beneficial to reduce the overall thickness of the flexible circuit board, thereby reducing the thickness of elect...
Claims
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IPC IPC(8): H05K3/00H05K1/14
CPCH05K1/144H05K3/0058
Inventor 胡先钦沈芾云何明展徐筱婷韦文竹
Owner AVARY HLDG (SHENZHEN) CO LTD