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LED lead frame high speed cutting foot mold

A lead frame, high-speed technology, applied in the field of LED lead frame high-speed cutting foot mold, can solve the problems of difficult development, low cost, no oil supply, etc.

Active Publication Date: 2021-04-16
吉安市木林森精密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, the development of lead frame technology has advanced by leaps and bounds. The development of lead frame specifications has become smaller and smaller, the arrangement has become tighter, the width of the sheet has become larger and the thickness of the material has become thinner and thinner. Major manufacturers are vying to follow suit. The price of lamp beads It has been continuously explored, but there is basically no breakthrough in material selection; LED hardware lead frame technology has been developed so far, and its materials are still red copper, brass, and iron. After researching the market metal strips, it seems difficult to find a fourth. cost-effective material
[0005] After research, it was found that the performance of the same type of lead frame made of copper and aluminum was tested, and it was found that the performance of the aluminum lead frame was not worse than that of the copper lead frame, and even slightly better than that of the copper lead frame; this means that the aluminum lead frame has a relatively Copper lead frame has better performance and lower cost than iron lead frame (Although the unit price of aluminum is higher than that of iron, its specific gravity is much lighter. For the same weight of aluminum, the number of output lead frames is several times more than that of iron. double), so the LED aluminum lead frame is of great significance to the industry, but it is also extremely difficult to develop, but the stamping production quality is extremely unstable, and due to the special material of the aluminum material, it is particularly easy to produce dust when cutting the feet and stamping production , flying catkins, sticky edges, burrs, etc., and the quality requirements of LED lead frames are extremely high, and the cutting process cannot be oiled, which sets up multiple barriers for the design and production of LED aluminum lead frame cutting dies Therefore, those skilled in the art urgently need to develop a high-speed LED lead frame cutting mold to meet actual production needs.

Method used

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  • LED lead frame high speed cutting foot mold
  • LED lead frame high speed cutting foot mold
  • LED lead frame high speed cutting foot mold

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Embodiment Construction

[0039] The present application will be described in further detail below through specific embodiments in conjunction with the accompanying drawings. like Figure 1-15 As shown, the LED lead frame high-speed foot cutting die includes an upper die set 1 and a lower die set 2 adapted to the upper die set 1 .

[0040]Specifically, the upper die set 1 is provided with a first punch group 11 and a

[0041] The second punch group 12 on one side of the group 11, the first punch group 11 includes at least one first punch group 111, and the second punch group 12 includes at least one second punch group 121, The first punch set 111 and the second punch set 121 are staggered along the longitudinal direction of the upper die set 1, and the punching ends of the first punch set 111 and the second punch set 121 Both protrude from the lower end surface of the upper die set 1;

[0042] The lower die set 2 is provided with a first blanking groove group 21 adapted to the first punch group 111 ...

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Abstract

The application discloses a high-speed cutting die for LED lead frame, including an upper die set and a lower die set. The upper die set is provided with a first punch group and a second punch group, and the first punch group includes at least one set of first punches. The subgroup, the second punch group includes at least one second punch group, the first punch group and the second punch group are staggered along the longitudinal direction of the upper die group, and the first punch group and the second punch group The punching ends of the dies all protrude from the lower side of the upper die set; the lower die set is provided with a first blanking groove set that can be adapted to the first punch set, and a set of blanking grooves that can be adapted to the second set of punches. The second blanking trough group. This application can effectively solve a series of quality problems such as aluminum powder, aluminum scraps, flying catkins, sticky edges, and burrs that are particularly easy to produce during the production of LED aluminum lead frames, making the LED aluminum lead frame equipped with copper wires. The same quality assurance of the frame is conducive to further improving the innovation and development of LED technology and meeting higher requirements for use.

Description

technical field [0001] The present application relates to the technical field of LEDs, in particular to a high-speed leg-cutting mold for LED lead frames. Background technique [0002] Throughout the development of LED lighting technology, it has been a hundred years since the first discovery of the electroluminescence phenomenon of semiconductor material silicon carbide in 1907. Compared with traditional incandescent and fluorescent lighting equipment, LED is energy-saving, environmentally friendly, and long-lasting. The advantages such as lifespan are extremely prominent and widely valued (LEDs can save energy by 90% compared to incandescent lamps, and 50% compared to fluorescent lamps). All countries in the world are scrambling to formulate LED development plans that suit their own development conditions. Although China started relatively late However, it has come from behind. At present, the world's LED production and technological innovation capabilities have been mainl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21F11/00B21F23/00B21D28/14B21C51/00B21D37/16B08B5/02B21D45/06
CPCB08B5/02B21C51/00B21D28/14B21D37/16B21D45/06B21F11/00B21F23/00
Inventor 林木荣陈方郑子钦熊林权罗广鸿石红丽
Owner 吉安市木林森精密科技有限公司