Semi-automatic wafer discharging device based on wax-free polishing process

Abstract

The invention provides a semi-automatic wafer discharging device based on the wax-free polishing process. The semi-automatic wafer discharging device comprises a tool shell and a lifting bracket. Oneside of the tool shell is provided with a vertical strip-shaped hole. An electric cylinder and linear guide rails are vertically mounted in the position, on the outer side of the strip-shaped hole, ofthe tool shell. The driving end of the lifting bracket is connected with the electric cylinder and is clamped to the linear guide rails. The lifting bracket is connected with the front end of a jacking plate through a first cylinder. The lifting bracket is rotatably connected with the rear end of the jacking plate. Gear shaping plates are mounted on the jacking plate. Electric cylinder sliding tables are arranged on the gear shaping plates. The electric cylinder sliding tables are connected with a gear shaping device. The upper portion of the jacking plate is connected with a tray through a second cylinder. A center disk is mounted in the middle position of the upper surface of the tray. The edge of the center disk is provided with rollers. The semi-automatic wafer discharging device based on the wax-free polishing process has the beneficial effects of realizing semi-automatic wafer discharging, implementing discharging of wax-free polished wafers through a water gun in place of manual operation and preventing the disadvantages that the surface granularity of polished wafers is improved through to manual wafer discharging and the damage rate is increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semi-automatic unloading device based on a wax-free polishing process. Background technique [0002] In the field of semiconductor silicon wafer manufacturing, silicon wafer particle size and surface scratches are one of the important quality issues, which are directly related to whether polished wafers can be used in subsequent production. In the existing process, the blanking of the wax-free polishing sheet is all done manually. After the operator pushes out the blanking cart loaded with the polishing sheet, after rinsing the surface of the silicon wafer, he uses his fingers to pinch the polishing sheet for reference. At the surface, remove the polishing sheet from the ceramic disc polishing pad, and then put it into the ramp of the existing unloading machine to complete the unloading. [0003] Subsequent inspections of the wax-free polished wafers that were manual...

AI Technical Summary

Problems solved by technology

[0003] Subsequent inspections of the wax-free polished wafers that were manually removed showed that the particle size at the reference surface of the wax-free polished wafers increased significantly, and there were scratches on the silicon wafers, which affected the product quality of the wax-free polished wafers.

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