Back-attached heat-insulation plate structure

Abstract

The invention provides a back-attached heat-insulation plate structure, and relates to the technical field of heat insulation of buildings. The back-attached heat-insulation plate structure comprisesback plates; the back plates are divided into two structures including first back plates and second back plates; first convex plates and second convex plates are formed in the upper and lower sides ofthe first back plates respectively; the plate length of the first convex plates and the second convex plates is identical with the plate width of the first back plates; grooves are fixedly formed between the first convex plates and the second convex plates; attachment plates are fixedly connected in the grooves; the surfaces where the upper surfaces of the attachment plates are located are identical with the surfaces where the upper surfaces of the first convex plates and the upper surfaces of the second convex plates are located; protective binders are connected on the outer surfaces of theattachment plates in a fit manner; the bottom surfaces of the protective binders fit the upper surfaces of the first convex plates and the second convex plates on the upper and lower sides respectively; and clamping grooves are fixedly formed in the lower ends of the first convex plates. Through use of three layers of structures, the whole heat-insulation plate plays the heat-insulation, fireproofand protective effects, the structure has two forms of the back plates, and thus the practicability of the heat-insulation plate is enhanced.

Description

technical field [0001] The invention relates to the technical field of building heat insulation, in particular to a back-attached heat insulation board structure. Background technique [0002] The insulation board is easy to understand, it is a board for building insulation. The thermal insulation board is a rigid foam plastic board made of polystyrene resin as raw material plus other raw and auxiliary materials and polymers, mixed with heat and injected with a catalyst, and then extruded to form a rigid foam plastic board. It has moisture-proof and waterproof properties. To reduce the thickness of the building's outer enclosure structure, thereby increasing the indoor usable area, there are various technical solutions for thermal insulation panels on the market, including organic thermal insulation panels, inorganic thermal insulation panels, vacuum thermal insulation panels, thermal insulation and decorative integrated panels, etc. [0003] However, the existing thermal i...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a back-attached heat insulation and heat preservation board structure, which solves the problem that the single structure of the heat preservation board cannot realize heat preservation and fire prevention

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