Thin-film pressure sensor and manufacturing method

A thin-film pressure sensor technology, applied in the field of sensors, can solve the problems of thin-film pressure sensor application quality limitations, reduced sensor sensitivity performance, and weak wire connection, etc., to achieve the effects of ensuring pressure-sensitive performance, easy manufacturing method, and simple structure

Inactive Publication Date: 2020-02-21
宇博智能科技(杭州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the thin-film pressure sensors on the market are all based on the silk screen printing process, and the interface part mainly adopts piercing cold-pressed terminals, which are not firmly connected to the wires during use and cannot be subjected to forces such as extrusion, resulting in a short service life. The application quality of the thin film pressure sensor is greatly limited
Although there is a method for making electrodes on a flexible circuit board, this method reduces the sensitivity of the sensor

Method used

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  • Thin-film pressure sensor and manufacturing method
  • Thin-film pressure sensor and manufacturing method

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Embodiment

[0011] Example: Combine figure 1 , figure 2 An embodiment of the thin film pressure sensor of the present invention will be described. Firstly, the drawing design of the thin-film sensor is carried out, including the sensor shape, the design of the interface electrode on the lower substrate film, the printed electrode, the sensitive material layer, the adhesive material layer, and the touch electrode, printed electrode, and sensitive material layer on the upper substrate film. Drawings of the various parts of the sensor. According to the design drawing of the sensor, use the 0.1mm thick flexible copper clad film to cut two pieces of the same size copper clad film, respectively, as the upper and lower film substrates (1) and (2); use the etching technology in the flexible circuit board manufacturing process , the touch electrode (7) and the interface electrode (3) are etched on the upper and lower film substrates (1) and (2); the upper and lower film substrates (1) and (2) a...

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Abstract

The invention discloses a thin-film pressure sensor and a manufacturing method. The thin-film pressure sensor is composed of two layers of thin-film substrates which are respectively an upper-layer thin-film substrate and a lower-layer thin-film substrate; the lower-layer thin-film substrate is covered with an interface electrode, a printed electrode, a sensitive material layer and a bonding material layer; and the upper-layer thin-film substrate is covered with a touch electrode, a printed electrode and a sensitive material layer. With the sensor adopted, pressure can be tested; with specialstructural design adopted, a sensor interface can be firmer; and the sensor has high sensitivity and has a longer service life. The manufacturing method is simple and can realize batch production.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a film pressure sensor in the field of pressure sensors. Background technique [0002] A sensor is a detection device that can sense the information being tested and convert the detected information into electrical signals or other required forms of information output according to certain rules. It is widely used in construction, water conservancy, geology, chemical industry, and medical treatment. , Internet of Things and other fields. Pressure sensor is one of various types of sensors, among which thin-film pressure sensors have advantages that other solid-state pressure sensors cannot match, such as softness, flexibility, small size, corrosion resistance, etc., especially thin-film force sensors in some pairs of measurement spaces Where there are restrictions, it is widely used in the market to replace the bulky and bulky pressure sensor with irreplaceable advantages such as light and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L7/08
CPCG01L7/082
Inventor 不公告发明人
Owner 宇博智能科技(杭州)有限公司
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