Interconnect package, interconnect device and method of making an interconnect device for optical communication

Abstract

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer / deserializer circuits, transceivers, clocking circuitry, and / or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electricallyconnected to the integrated switch ASIC. The invention also provides an interconnect device and method of making the interconnect device for optical communication.

Description

technical field [0001] Embodiments of the invention relate to interconnect packages, interconnect devices, and methods of making interconnect devices for optical communication. Background technique [0002] Optical interconnect systems used to transfer data between computing devices typically provide higher bandwidth than electrical interconnects such as copper wires. However, some optical interconnect systems use a discrete electronic die (eDie) and a discrete photonic die (pDie) for each individual channel, where components on the eDie at least partially process and / or control the signals transmitted from the pDie and from the Signal received by pDie. Using two discrete dies can be expensive and inefficient in terms of power consumption and the amount of area required to provide the total number of discrete dies. [0003] Additionally, in some embodiments, the use of a discrete eDie and a discrete pDie can separate the eDie from the switching ASIC by a large distance. T...

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The SerDes circuit can also add to the cost of the communication system

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