Method for automatically creating via hole in copper sheet of PCB
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUIZHOU KING BROTHER CIRCUIT TECH
- Publication Date
- 2020-02-28
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for automatically creating a via hole on a PCB copper skin. Background technique
[0002] At present, Allegro printed circuit board (Printed Circuit Board, PCB) design software is more and more favored by users. After using the design software to complete the layout and wiring of the PCB and laying copper, the user needs to punch some ground vias on the copper skin of the power supply. The main functions are as follows: it can increase the conductive area, relieve the current pressure of the bottleneck part of the circuit, and effectively Reduce the return path of the current; it can play the role of heat dissipation, especially if more holes are drilled under the heating device to increase the release of heat and buffer the deformation of the circuit board; it can play the role of electromagnetic radiation isolation, A space loop will be formed bet...