Method for automatically creating via hole in copper sheet of PCB

An automatic creation and via technology, which is applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of uneven drilling and low efficiency, so as to improve efficiency and signal integrity, improve work efficiency, and alleviate The effect of current pressure
CN110852033APending Publication Date: 2020-02-28HUIZHOU KING BROTHER CIRCUIT TECH +2

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUIZHOU KING BROTHER CIRCUIT TECH
Publication Date
2020-02-28

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Abstract

The invention provides a method for automatically creating a via hole on a copper sheet of a PCB (Printed Circuit Board), which is characterized in that the PCB can automatically search and acquire position information corresponding to a related instruction when receiving external instruction information under a current window, and create and place the via hole according to requirements in the instruction. According to the method, when an external trigger is received, via holes can be automatically created in a ground network copper sheet according to set intervals and arrays, careless omission caused by manually placing the via holes can be avoided, the working efficiency is improved, the conductive area can be increased, the current pressure of a bottleneck part can be relieved, the impedance of a circuit can be reduced, and the integrity of signals can be enhanced.
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Description

technical field

[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for automatically creating a via hole on a PCB copper skin. Background technique

[0002] At present, Allegro printed circuit board (Printed Circuit Board, PCB) design software is more and more favored by users. After using the design software to complete the layout and wiring of the PCB and laying copper, the user needs to punch some ground vias on the copper skin of the power supply. The main functions are as follows: it can increase the conductive area, relieve the current pressure of the bottleneck part of the circuit, and effectively Reduce the return path of the current; it can play the role of heat dissipation, especially if more holes are drilled under the heating device to increase the release of heat and buffer the deformation of the circuit board; it can play the role of electromagnetic radiation isolation, A space loop will be formed bet...

Claims

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