Continuous feeding, conveying and mounting equipment for mounting of components on circuit layer

Abstract

The invention discloses continuous feeding, conveying and mounting equipment for mounting of components on a circuit layer. The equipment comprises a bottom plate, and is characterized in that the upper side of the bottom plate is fixedly connected with one ends of a set of supporting rods; the other end of each supporting rod is fixedly connected with one end of a corresponding square plate; oneside of each square plate is hinged to one end of a group of uniformly arranged rollers 2; the two ends of each rollers 2 are fixedly and respectively connected with a rotating wheel 2; the two ends of a conveying belt are surrounded by the corresponding rollers 2 respectively; the two ends of a symmetrical belt 1 are surrounded by the corresponding rotating wheels 2 correspondingly; one end of one square plate is fixedly connected with a motor 1; an output shaft of the motor 1 is hinged to one square plate; and a transverse plate of the U-shaped plate is fixedly connected with a mounting mechanism. The invention relates to the field of component conveying and mounting equipment, in particular to the continuous feeding, conveying and mounting equipment for mounting of the components on the circuit layer. The equipment can mount the components on the circuit layer conveniently.

Description

technical field [0001] The invention relates to the field of component conveying and mounting equipment, in particular to a component mounting circuit layer continuous feeding conveying and mounting equipment. Background technique [0002] Electronic component surface mount equipment is to paste electronic components on the solder paste on the circuit layer, and then weld the electronic components on the circuit layer by hot melting. The device is picked up and placed precisely on a specific position on the circuit layer. Due to the high welding precision requirements of electronic components, traditional equipment cannot work continuously, and the circuit layer can only be processed in sections. The efficiency is low and cannot be fully utilized. The working efficiency of the equipment, and the existing ones cannot adjust the distance between the electrical components when they are transported. This is, the weak point of prior art. Contents of the invention [0003] The...

AI Technical Summary

Problems solved by technology

[0002] Electronic component surface mount equipment is to paste electronic components on the solder paste on the circuit layer, and then weld the electronic components on the circuit layer by hot melting. The device is picked up and placed precisely on a specific position on the circuit layer. Due to the high welding precision requirements of electronic components, traditional equipment cannot work continuously, and the circuit layer can only be processed in sections. The efficiency is low and cannot be fully utilized. The working efficiency of the equipment, and the existing distance between electrical components cannot be adjusted

Images