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Wire cutting cleaning device and wire cutting system

A cleaning device and wire cutting technology, applied in the field of wire cutting system and wire cutting cleaning device, can solve the problems of reducing the service life of winding reels and axles, pollution and damage of reels and axles, and achieve good cutting effects

Active Publication Date: 2021-11-02
XIAN ESWIN MATERIAL TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the mortar attached to the cutting line, when the cutting line moves from the cutting unit to the wiring unit, the mortar will be brought into the wiring unit from the cutting unit by the cutting line, thereby causing pollution and damage to the winding wheel and axle in the wiring unit. damage, reducing the service life of reels and axles

Method used

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  • Wire cutting cleaning device and wire cutting system
  • Wire cutting cleaning device and wire cutting system
  • Wire cutting cleaning device and wire cutting system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] In order to solve the above problems, this embodiment provides a wire cutting cleaning device 100 capable of cleaning the cutting wire 140 returning from the cutting unit 300 to the wire routing unit 200 .

[0037] Please also see Figure 2 to Figure 4 , figure 2 It is a schematic diagram of the installation position of a wire cutting cleaning device provided by an embodiment of the present invention; image 3 It is a structural schematic diagram of a wire cutting cleaning device provided by an embodiment of the present invention; Figure 4It is a schematic diagram of a control module of a wire cutting cleaning device provided by an embodiment of the present invention. The wire cutting cleaning device 100 of this embodiment is used in a wire cutting system including a wire routing unit 200 and a cutting unit 300, and the wire cutting cleaning device 100 is arranged between the wire routing unit 200 and the cutting unit 300, and the cutting wire 140 passes through Wi...

Embodiment 2

[0048] On the basis of the above embodiments, this embodiment provides a wire cutting system. See figure 2 and image 3 , the wire cutting system of this embodiment includes a wire cutting unit 200, a cutting unit 300 and one or more wire cutting cleaning devices 100 described in Embodiment 1, wherein the wire cutting unit 200 is used to supply the cutting unit 300 with cutting The wire 140 ; ​​the cutting unit 300 is used to cut the workpiece 400 with the cutting wire 140 .

[0049] When cutting, the workpiece 400 (silicon ingot) to be cut is fixed on the feeding device 310 that can move up and down in the cutting unit 300, the driving wheel 320 and the driven wheel 330 are arranged in parallel below the feeding device 310, and the cutting line 140 is wound Between the driving wheel 320 and the driven wheel 330 , and the driving wheel 320 is connected to the electric motor 340 . The electric motor 340 can drive the driving wheel 320 to rotate along its central axis, there...

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PUM

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Abstract

The invention discloses a wire cutting cleaning device, which is applied to a wire cutting system including a wire routing unit and a cutting unit. The wire cutting cleaning device includes a first mortar supply unit, a cleaning liquid supply unit and a control unit, wherein the The control unit is electrically connected to the first mortar supply unit and the cleaning liquid supply unit, and is used to control the first mortar supply unit to supply mortar on the cutting line moving from the wiring unit to the cutting unit, And control the cleaning liquid supply unit to supply cleaning liquid on the cutting line moving from the cutting unit to the wiring unit. Also disclosed is a wire cutting system, including a wire routing unit, a cutting unit, and one or more wire cutting cleaning devices. The wire cutting cleaning device can clean the cutting wire returned to the wire routing unit, and can effectively prevent impurities such as mortar from polluting and damaging the winding wheel and the axle in the wire routing unit.

Description

technical field [0001] The present invention relates to the technical field of wire cutting, and more particularly, to a wire cutting cleaning device and a wire cutting system. Background technique [0002] Wire cutting is one of the very effective methods for cutting silicon ingots. See figure 1 , figure 1 It is a schematic diagram of a wire cutting system in the prior art. The existing wire cutting system can generally be divided into two units: a cutting unit 300 and a wire routing unit 200 . The wire cutting mechanism of silicon ingot is to fix the silicon ingot to be cut on the feeding device 310 that can move up and down. When the feeding device 310 gradually descends, the workpiece 400 (silicon ingot) fixed on the feeding device is fed The cutting tool below the device 310 is separated. Usually, the cutting tool is a cutting wire 140 wound between two rotating shafts, and the cutting wire is provided by the wire routing unit. [0003] During the wire cutting pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/02B28D7/00
CPCB28D5/0064B28D5/007B28D5/0076B28D5/045
Inventor 郭宇轩赵晟佑
Owner XIAN ESWIN MATERIAL TECH CO LTD