Chip bonding bump printing mechanism and printing method

Abstract

The invention discloses a chip bonding bump printing mechanism and a printing method. The chip bonding bump printing mechanism comprises a base body, a conveying station fixedly installed on the base,a numerical control sliding table fixedly installed on the base and a bump printing mechanism installed on the base. The salient point printing mechanism comprises a support fixedly installed on thebase, a dispensing mechanism fixedly installed on the support, a salient point printing mechanism fixedly installed on the numerical control sliding table and turnover devices fixedly installed on thetwo sides of the numerical control sliding table. According to the invention, dispensing is carried out on the chip through the salient point printing mechanism; after dispensing is finished, the numerical control sliding table drives the dispensed chip to turn over to the device; the turnover device is driven by the first driving motor and the second driving motor to turn over the dispensing surface to the surface corresponding to the convex groove of the printing disc, and adjusts the chip to be placed corresponding to the convex groove of the printing disc, thereby avoiding irreparable damage to the chip caused by multiple spot welding, and facilitating the welding qualification rate of the chip in later bonding.

Description

technical field [0001] The invention belongs to the field of mechanical automation, in particular to a chip bonding bump printing mechanism and a printing method. Background technique [0002] Chip bonding usually adopts the method of eutectic or sticking tin to connect the substrate with the wire. Before the connection, it is necessary to make a connection bump on the chip as the first bonding point for the wire connection. Most of the existing substrates use copper chips, and then use Welding tools weld the solder on the chip. The melting point of common metal solder used to make bumps is mostly between 280°C and 400°C, and the bumps are mostly distributed in arrays on the chip, and the distance between the bumps is small. Welding is complicated. During the chip welding process, the gate of the chip is often burned due to poor heat dissipation of the chip due to low penetration rate and repeated spot welding. Secondly, the thickness of the metal bumps for spot welding is ...

AI Technical Summary

Problems solved by technology

[0002] Chip bonding usually adopts the method of eutectic or sticking tin to connect the substrate with the wire. Before the connection, it is necessary to make a connection bump on the chip as the first bonding point for the wire connection. Most of the existing substrates use copper chips, and then use Welding tools weld the solder on the chip. The melting point of common metal solder used to make bumps is mostly between 280°C and 400°C, and the bumps are mostly distributed in arrays on the chip, and the distance between the bumps is small. Welding is complicated. During the chip welding process, the gate of the chip is often burned due to poor heat dissipation of the chip due to low penetration rate and repeated spot welding.

Secondly, the thickness of metal bumps for spot welding is different, and the welding accuracy of bumps is not high, the welding cycle is long, and the accuracy and success rate are low.

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