Laser processing system and laser processing method

Abstract

The invention discloses a laser processing system. The laser processing system comprises a laser, an optical shutter assembly and a controller, wherein the laser is used for emitting a laser beam, andthe laser beam acts on a workpiece to be processed so as to carry out laser processing; the optical shutter assembly is arranged on the light path of the laser beam and comprises a light blocking part, and the light blocking part is rotatably arranged and used for allowing the laser beam to pass through or blocking the laser beam; and the controller controls the light blocking part to rotate so as to control the passing or blocking time of the laser beams, so that the laser beams act on the processed workpiece at intervals. The light blocking part in the optical shutter assembly is rotationally arranged and used for allowing the laser beams emitted by the laser device to pass through or be blocked, the laser beams can selectively conduct laser processing, and the processing efficiency isimproved. The time for the light blocking part to pass through or block the laser beam is achieved by controlling the light blocking part to rotate through the controller, and automation and precisionof laser processing are achieved. Meanwhile, the invention further discloses a laser processing method.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser processing system and a laser processing method. Background technique [0002] In the processing operation of the display panel, the entire mother board is cut to obtain a single display panel unit, so that it can be applied to actual product production. When cutting the display panel units in the same row or column on the motherboard, the cutting trajectory is discontinuous, and the motherboard is distributed with cutting parts and non-cutting parts at intervals, and the length of the non-cutting parts in the same row or column is extremely short. Even as short as a few millimeters, and the length of the general cutting part can reach tens or even hundreds of millimeters. When cutting the entire motherboard, it is necessary to stop frequently in the non-cutting part to obtain a good processing effect. , such repeated pauses will lead to greatly exte...

AI Technical Summary

Problems solved by technology

When cutting the display panel units in the same row or column on the motherboard, the cutting trajectory is discontinuous, and the motherboard is distributed with cutting parts and non-cutting parts at intervals, and the length of the non-cutting parts in the same row or column is extremely short. Even as short as a few millimeters, and the length of the general cutting part can reach tens or even hundreds of millimeters. When cutting the entire motherboard, it is necessary to stop frequently in the non-cutting part to obtain a good processing effect. , such repeated pauses will lead to greatly extended processing time and low processing efficiency

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