Electrostatic chuck separation device

Abstract

The electrostatic chuck separating device of the invention relates to a mechanical device for separating electrostatic chucks. The purpose is to provide an electrostatic chuck separating device capable of non-destructively and quickly separating the electrostatic chuck and the chuck base. The electrostatic chuck separation device of the present invention includes a guide member, a rotating member installed above the guide member and capable of synchronously moving with the guide member, and a fixedly installed cutting member, the electrostatic chuck assembly is installed above the rotating member and can rotate synchronously with the rotating member , the cutting part can generate heat and generate heat that can melt the adhesive layer when it is powered on. When the guiding part drives the rotating part to move to a certain position synchronously, as the electrostatic chuck moves and rotates at the same time, the cutting part can The adhesive layer is cut to separate the electrostatic chuck from the components on the electrostatic chuck assembly. The electrostatic chuck separation device of the present invention has simple structure, is easy to manufacture, has high separation efficiency, wide application range, and can realize non-destructive separation.

Description

technical field [0001] The invention relates to the design and manufacture field of semiconductor equipment, in particular to a mechanical device for separating an electrostatic chuck. Background technique [0002] Generally, after the electrostatic chuck is used for a certain period of time, its adsorption force will be lost, resulting in a decrease in the adsorption force or even unable to continue to adsorb, resulting in unstable or unreliable adsorption to the wafer, which may cause damage to the wafer by other equipment. However, the price of the wafer is expensive, and the damage of the wafer causes an increase in the cost of the enterprise. Therefore, it is necessary to regularly check or replace the electrostatic chuck to ensure that it has sufficient adsorption force on the wafer. For the convenience of maintenance or the replacement of the electrostatic chuck, it is necessary to separate the electrostatic chuck from the chuck base and process the electrostatic chu...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, a mechanical saw blade is usually used to cut and separate the electrostatic chuck, which often causes damage to the electrostatic chuck during the cutting and separation process, and its operation is not convenient enough, which is time-consuming and laborious

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