Hole plugging method for solder mask holes of circuit board
A circuit board, solder mask technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem of high product defect rate
Active Publication Date: 2020-04-03
三芯威电子科技(江苏)有限公司
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Utilizing the hole plugging method of the present invention can effectively improve the filling degree of ink in the anti-welding hole, and can effectively avoid cracking of the anti-welding hole, thus effectively solving the problem of high defective rate of products caused by plugging the anti-welding hole
Method used
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[0026] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0027] The first cap used in the plugging method of the solder-proof hole of the circuit board of the present invention is made of elastic silicon rubber material, see image 3 As shown, the first cap 1 includes a cover body 11 and an annular snap-in edge 12 that can extend into the solder-proof hole, and the thickness of the snap-in edge 12 does not exceed one-tenth of the diameter of the solder-proof hole. When the first cap 1 is inserted into the solder-proof hole, the volume of the solder-proof hole occupied by the first cap 1 is reduced as far as possible, so that the solder-proof hole is fully filled with ink.
[0028] see Figure 4 As sho...
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The invention discloses a hole plugging method of a solder mask hole of a circuit board. The hole plugging method comprises the following steps: plugging a first cap into the lower end of the solder mask hole formed in a circuit board substrate, and then injecting ink into the solder mask hole; after the solder mask hole is filled with ink, plugging a second cap into the other end of the solder mask hole, pressing the end, facing the first cap, of the second cap until the ink flows out of the solder mask hole, and then taking down the second cap; and pre-baking the circuit board at the temperature of 60-100 DEG C for 30-60 min. By utilizing the method, the solder mask hole of the circuit board can be ensured to be fully filled, no fault or hole exists in the solder mask hole after the printing ink is cured and formed, and the solder mask hole cannot be cracked. The method provided by the invention solves the problem of high solderability reject ratio caused by high hole crack reject ratio of the cap surface of the circuit board, thereby greatly reducing the reject ratio of products.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing technology, in particular to a method for plugging solder-proof holes of a circuit board. Background technique [0002] In order to facilitate the assembly and use of circuit boards, during the processing of circuit boards, a number of through holes are usually opened on the circuit board, such as locking screw through holes for fixing with external connectors, or pin insertion holes for electronic components. socket. When processing circuit boards, it is necessary to carry out anti-soldering treatment on the through holes on the circuit board, because when soldering electronic components on the circuit board, most of the circuit boards need to be tinned, and the tinning process is completed in a tin furnace Therefore, the through holes on the circuit board need to be plugged before tinning, that is, the through holes on the circuit board need to be treated with anti-soldering...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2201/0959
Inventor 陈宗兵
Owner 三芯威电子科技(江苏)有限公司