Vibration sensing device and electronic equipment

A technology for sensing devices and vibration components, which is applied in the direction of measuring devices, sensors, electrical components, etc., can solve the problems affecting the reliability of vibration sensing devices, large size of vibration sensing devices, inconvenient use and assembly, and achieve effective Facilitate assembly and use, reduce size, and avoid direct contact

Active Publication Date: 2020-04-07
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing vibration sensing device, the vibrating elements are all directly arranged outside the vibration sensor, which will cause the size of the entire vibration sensing device in the height direction to be relatively large, and the volume will also be large, which is inconvenient to use and assemble, and cannot Meet the needs of light and thin
Moreover, the vibration element directly faces the external environment, because the structure of the vibration element itself is relatively fragile, which will affect the reliability of the vibration sensing device

Method used

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  • Vibration sensing device and electronic equipment
  • Vibration sensing device and electronic equipment

Examples

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Embodiment Construction

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0036] Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.

[0037] In all examples shown and discussed herein, any specific values ​​should be construed as illustrative only, and not as limiting. Therefore, other instances of the exemplary embodiment may have different values.

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PUM

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Abstract

The invention relates to a vibration sensing device and electronic equipment. The vibration sensing device comprises a substrate and a shell, a packaging structure with a containing cavity is definedby the substrate and the shell, and an MEMS chip is contained in the containing cavity. The vibration sensing device further comprises a protective shell, the protective shell is contained in the containing cavity and fixedly arranged on the substrate, a cavity is defined by the protective shell and the substrate, the MEMS chip is fixedly arranged on the protective shell, a through hole is formedin the protective shell, and a back cavity of the MEMS chip is communicated with the cavity through the through hole. And the device further comprises a vibration element, and the vibration element islocated in the cavity and is configured to respond to external vibration. The vibration sensing device has the advantages that the size of the whole vibration sensing device in the height direction can be reduced, and assembly is more facilitated.

Description

technical field [0001] The present invention relates to the technical field of vibration sensing, more specifically, the present invention relates to a vibration sensing device and electronic equipment. Background technique [0002] Existing vibration sensing devices generally include a housing and a mass block disposed in the housing. The mass block is suspended in the housing through the diaphragm, and the mass block and the diaphragm together form a vibration element. The housing has an open end. The base plate of the vibration sensor is hermetically connected to the open end of the housing. A MEMS chip and an ASIC chip are arranged on the side of the substrate opposite to the casing, and a casing arranged outside the MEMS chip and the ASIC chip is also included. The substrate has through holes. The MEMS chip communicates with the inner cavity of the casing through the through hole. [0003] When working, the vibration sensing device is fixed on the equipment to be m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00H04R19/04G01H17/00
CPCG01H17/00H04R19/005H04R19/04H04R2201/003
Inventor 端木鲁玉付博李欣亮孙健
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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