Multilayer interconnected FPC

Abstract

The invention discloses an FPC, and aims to provide a multilayer interconnection FPC which is simple in structure, high in material utilization rate and stable in performance. The FPC comprises a mainFPC and an auxiliary FPC. The main FPC is provided with a main output area and a main input area, and the auxiliary FPC is provided with an auxiliary output area and an auxiliary input area. A plurality of main output bonding pads connected with the main FPC circuit are arranged in the main output area. A plurality of main input bonding pads connected with the main FPC circuit are arranged in themain input area. A plurality of auxiliary output bonding pads which are connected with the auxiliary FPC circuit and are in one-to-one correspondence with the main input bonding pads are arranged inthe auxiliary output area, and a plurality of auxiliary input bonding pads which are connected with the auxiliary FPC circuit and are in one-to-one correspondence with the main output bonding pads arearranged in the auxiliary input area. The auxiliary input bonding pad is welded on the main output bonding pad, and the auxiliary output bonding pad is welded on the main input bonding pad. The FPC is applied to the technical field of FPC production.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a multilayer interconnected FPC. Background technique [0002] Multi-layer board FPC has multi-layer wiring layers, and an insulating layer is provided between two adjacent wiring layers. Multi-layer circuit boards generally have at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized Within an insulating board, the electrical connections between them are usually made through plated through-holes in the cross-section of the board. For some multi-layer FPCs, the number of traces in a certain conductive layer is small, resulting in a small actual use area of ​​this layer, low material utilization rate, and great material waste. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a multi-layer interconnecte...

AI Technical Summary

Problems solved by technology

For some multi-layer FPCs, the number of traces in one of the conductive layers is small, resulting in a small actual use area of ​​the layer, low material utilization, and a large waste of materials.

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