Multilayer interconnected FPC

A one-to-one correspondence, main output technology, applied in the direction of electrical connection of printed components, structural connection of printed circuits, printed circuit components, etc., can solve the problems of small actual use area, low material utilization rate, material waste, etc., and achieve structural The effect of simplicity, high material utilization and stable performance

Inactive Publication Date: 2020-04-10
ZHUHAI YUANSHENG ELECTRONICS SCI & TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For some multi-layer FPCs, the number of traces in one of the conductive layers is small, resulting

Method used

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Examples

Experimental program
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Example Embodiment

[0022] Such as Figure 1 to Figure 4 As shown, in this embodiment, the multi-layer interconnection FPC includes a main FPC1 and an auxiliary FPC2, the main FPC1 is provided with a main output area 3 and a main input area 4, and the auxiliary FPC2 is provided with an auxiliary output Area 5 and auxiliary input area 6; the main output area 3 is provided with a number of main output pads 7 connected to the main FPC1 circuit, and the main input area 4 is provided with a number of circuits connected to the main FPC1 Connected to the main input pad 8. A number of auxiliary output pads 9 connected to the auxiliary FPC2 circuit and corresponding to the main input pad 8 are provided in the auxiliary output area 5. The auxiliary input area A number of auxiliary input pads 10 connected to the auxiliary FPC2 circuit and corresponding to the main output pads 7 are provided in 6; the auxiliary input pads 10 are soldered on the main output pads 7, The auxiliary output pad 9 is soldered to th...

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Abstract

The invention discloses an FPC, and aims to provide a multilayer interconnection FPC which is simple in structure, high in material utilization rate and stable in performance. The FPC comprises a mainFPC and an auxiliary FPC. The main FPC is provided with a main output area and a main input area, and the auxiliary FPC is provided with an auxiliary output area and an auxiliary input area. A plurality of main output bonding pads connected with the main FPC circuit are arranged in the main output area. A plurality of main input bonding pads connected with the main FPC circuit are arranged in themain input area. A plurality of auxiliary output bonding pads which are connected with the auxiliary FPC circuit and are in one-to-one correspondence with the main input bonding pads are arranged inthe auxiliary output area, and a plurality of auxiliary input bonding pads which are connected with the auxiliary FPC circuit and are in one-to-one correspondence with the main output bonding pads arearranged in the auxiliary input area. The auxiliary input bonding pad is welded on the main output bonding pad, and the auxiliary output bonding pad is welded on the main input bonding pad. The FPC is applied to the technical field of FPC production.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a multilayer interconnected FPC. Background technique [0002] Multi-layer board FPC has multi-layer wiring layers, and an insulating layer is provided between two adjacent wiring layers. Multi-layer circuit boards generally have at least three conductive layers, two of which are on the outer surface, and the remaining layer is synthesized Within an insulating board, the electrical connections between them are usually made through plated through-holes in the cross-section of the board. For some multi-layer FPCs, the number of traces in a certain conductive layer is small, resulting in a small actual use area of ​​this layer, low material utilization rate, and great material waste. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a multi-layer interconnecte...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/14
CPCH05K1/111H05K1/141H05K1/147
Inventor 胡可胡高强张千胡潇然向勇
Owner ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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