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A laser cutting device

A laser cutting and laser technology, which is used in laser welding equipment, metal processing equipment, welding equipment, etc. to improve cutting efficiency and ensure accuracy.

Active Publication Date: 2021-11-02
东莞市盛雄激光先进装备股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a laser cutting device to solve the technical problem of how to ensure the accuracy of cutting wafer blanks and improve the cutting efficiency of wafer blanks

Method used

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  • A laser cutting device

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Embodiment Construction

[0029] The technical solutions of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0030] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a spec...

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Abstract

The application provides a laser cutting device, including: a laser, a rotating mirror cutting head module, a linear platform, a base and a support; the support is fixed on the base; the laser and the rotating mirror cutting head The modules are all fixedly arranged on the support; the mirror cutting head module includes a multi-faceted mirror, a motor and an optical path correction component, and the output shaft of the motor is connected to the rotating shaft of the multi-faceted mirror; the said The linear platform is linearly and slidably arranged on the base, the material is loaded on the linear platform, and the multi-faceted rotating mirror is used to reflect the laser light onto the material to form a cutting line. This application achieves the technical effect of not only ensuring the cutting accuracy of wafer blanks, but also improving the cutting efficiency of wafer blanks, and solves how to not only ensure the cutting accuracy of wafer blanks, but also improve the cutting efficiency of wafer blanks. The technical problem of cutting efficiency.

Description

technical field [0001] The present application relates to the technical field of laser cutting, in particular to a laser cutting device. Background technique [0002] Demand for wafers has grown in recent years, driven by consumer applications such as smartphones, smart cards, and package-on-package. Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Wafer cutting is to cut and separate each grain on the wafer. Since the distance between grains is very small and the grains are quite fragile, so The precision requirement is quite high, coupled with the soaring demand, there is also a certain requirement for cutting efficiency. [0003] The existing cutting method is to use the cutter wheel cutting method or the laser vibrating mirror cutting method; the cutter wheel cutting method is used, the cutting speed is slow, and it will cause certain friction on the cutting edge, and the cutting accuracy and efficiency are relativel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/064B23K26/70
CPCB23K26/38B23K26/064B23K26/702
Inventor 徐俊南李光辉陆俊李万朋何俊添
Owner 东莞市盛雄激光先进装备股份有限公司