A transfer device for silicon wafer processing

Abstract

The invention discloses a transfer device for silicon wafer processing, which comprises a base, storage shells equidistantly distributed are installed on the outer wall of the top of the base, and fixed blocks are installed on the outer walls of both sides of the storage shell, and the two fixed blocks The outer wall on the opposite side is rotatably connected to the same two-way screw rod, and both sides of the outer wall of the two-way screw rod are connected to the first sliding block through screw thread rotation, and the outer walls at both ends of the first sliding block are equipped with storage housings for storage. A rubber pad is installed on the inner wall of the bottom of the housing, and the outer wall of the top of the rubber pad is equipped with partitions distributed equidistantly, and the top of the outer wall on the opposite side of two adjacent partitions is hinged with an extrusion plate. In the present invention, the storage case can be moved quickly by being provided with a two-way screw rod, a first sliding block, a fixed block and a partition plate, so that it can be stored conveniently. Squeezing it increases the fixation rate and prevents movement of the wafer during movement.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a transfer device for silicon wafer processing. Background technique [0002] On a silicon chip the size of a grain of rice, 160,000 transistors have been integrated, which is another milestone in the progress of science and technology. The silicon element with a content of 25.8% in the earth's crust provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, for products destined to enter the mass market, such as solar cells, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics. [0003] With the rapid development of the semiconductor industry, the production capacity of semiconductor silicon wafers is expanding day by day. In silicon wafer processing enterprises, in order to ensure the safety of silicon wafer p...

AI Technical Summary

Problems solved by technology

During the transfer between the silicon wafer detection process and the film packaging process, at present, a certain number of silicon wafers are inserted with marking paper and then divided into several units and packed in foam boxes. The foam boxes are put into cartons and sealed, and then transported to film packaging. However, this operation greatly increases the working efficiency of the staff and is not convenient for people to use. Therefore, there is an urgent need for a transfer device for silicon wafer processing to solve the above problems

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