A cutting method of multi-layer composite material

Abstract

The invention relates to the technical field of material cutting, and discloses a cutting method for multilayer composite materials. Wherein the cutting method of the multilayer composite material comprises the following steps: the first cutter cuts the solder resist oil layer and the insulating adhesive layer of the multilayer composite material; the second cutter cuts the multilayer composite material on the basis of the cutting groove cut by the first cutter The silicon layer of the multi-layer composite material; the third cutter cuts the epoxy resin glue layer and the glass layer of the multi-layer composite material on the basis of the cutting groove cut by the second cutter. The present invention solves the problems of low yield rate, severe knife breakage and failure of normal mass production caused by a single cutting of a knife, realizes smooth mass production of multilayer composite materials, improves the yield rate of multilayer composite materials, and increases the number of knives service life and reduce production costs.

Description

technical field [0001] The invention relates to the technical field of material cutting, in particular to a cutting method for multilayer composite materials. Background technique [0002] Multilayer composite materials are widely used in the semiconductor industry, and are often used in applications such as fingerprint locks and image sensors. like figure 1 As shown, the composition of the multi-layer composite material mainly includes a chip layer 400, a silicon layer 500 and a glass layer 700, and the multi-layer composite material is a solder mask oil layer 100, a metal circuit layer 200, an insulating adhesive layer 300, and a chip layer from top to bottom. layer 400 , insulating glue layer 300 , silicon layer 500 , epoxy glue layer 600 and glass layer 700 . Wherein, the chip layer 400 and the metal circuit layer 200 are arranged intermittently at the cutting site, so as to ensure that the chip layer 400 and the metal circuit layer 200 are not damaged during the cutti...

AI Technical Summary

Problems solved by technology

On the one hand, this kind of cutting method is rough on the cutting part of the glass layer 700, resulting in poor sealing effect, mist or impurities in the air can easily enter the inside of the glass, induction recognition failure, and equipment failure; on the other hand, due to the soft silicon material, Cutting with one tool can easily cause the silicon layer 500 to crack, and the damaged silicon will damage the chip, and the yield is low; moreover, cutting with one tool at one time will cause serious wear and tear of the tool, and the life of the tool will be reduced, resulting in frequent tool changes

The above-mentioned adverse effects in many aspects make it impossible for multi-layer composite materials to be mass-produced

Images