A combination of conductive particles
A technology of conductive particles and particles, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, to achieve good electrical and thermal conductivity
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Embodiment 1
[0057] Silver powder with a peak particle size of 10 μm and silver powder with a peak particle size of 3 μm are selected for the combination of conductive particles.
[0058] The weight of each component of the conductive adhesive is:
[0059] Silver powder, 10μm: 63.33kg;
[0060] Silver powder, 3μm: 31.67kg;
[0061] Epoxy resin E51: 4.25kg;
[0062] Epoxy modifier CF2403: 0.5kg;
[0063] Boron trifluoride o-methylaniline: 0.25kg.
Embodiment 2
[0065] Silver powders with peak particle sizes of 10 μm, 3 μm and 1 μm were used for the combination of conductive particles.
[0066] The weight of each component of the conductive adhesive is:
[0067] Silver powder, 10μm: 54.28kg;
[0068] Silver powder, 3μm: 27.14kg;
[0069] Silver powder, 1μm: 13.58kg;
[0070] Epoxy resin E51: 4.25kg;
[0071] Epoxy modifier CF2403: 0.5kg;
[0072] Boron trifluoride o-methylaniline: 0.25kg.
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