Wafer automatic loading and unloading system

A wafer and automatic technology, applied in the direction of electrical components, conveyor objects, transportation and packaging, etc., can solve the problems of high mobility of workers and labor difficulties, and achieve the goal of avoiding wafer pollution, solving labor difficulties, and huge economic benefits Effect

Active Publication Date: 2021-01-12
SHANGHAI FORESIGHT ROBOTICS CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the above-mentioned defects in the prior art, and provide an automatic wafer loading and unloading system to improve the efficiency of the entire production process, avoid wafer contamination, and improve the pass rate of placing wafers into wafer trays. Reduce the scrap rate of wafers and solve the problem of high worker mobility and difficulty in employment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer automatic loading and unloading system
  • Wafer automatic loading and unloading system
  • Wafer automatic loading and unloading system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.

[0030] In the following specific embodiments of the present invention, please refer to figure 1 , figure 1 It is a structural schematic diagram of an automatic wafer loading and unloading system in a preferred embodiment of the present invention. Such as figure 1 As shown, an automatic wafer loading and unloading system of the present invention is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an automatic wafer loading and unloading system. The system comprises a storage unit integrated on process equipment, a wafer positioning unit, a wafer disc positioning unit and a wafer disc storage unit. A first loading unit is adopted to transmit wafer discs before and after the process between the wafer disc storage unit and the wafer disc positioning unit, and a secondloading unit is adopted to transmit wafers before and after the process among the wafer disc positioning unit, the wafer positioning unit and a storage unit. According to the system, the efficiency ofthe whole production process can be improved, wafer pollution is avoided, the percent of pass of the wafers placed in the wafer disc is improved, and the rejection rate of the wafers is reduced.

Description

technical field [0001] The invention relates to the technical field of automatic control of semiconductor equipment, in particular to an integrated wafer automatic loading and unloading system. Background technique [0002] In the wafer epitaxial PVD (Physical Vapor Deposition) process, it is necessary to place the wafer before deposition on the silicon carbide wafer disk, and after high-temperature deposition in the process equipment, the wafer is removed from the silicon carbide wafer disk out. [0003] At present, it is generally used to manually move the deposited FOUP (front-opening wafer transfer box) with multiple silicon carbide wafers from the PVD equipment to a position, and manually deposit each silicon carbide wafer The final wafer is taken out, and the other wafers before deposition are placed in the silicon carbide wafer tray. [0004] However, the problem of low pass rate occurs during manual operation. Since the wafer transportation is exposed to the ordin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
CPCH01L21/67739H01L21/67763
Inventor 陈朝星
Owner SHANGHAI FORESIGHT ROBOTICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap