Preparation method of multilayer substrate stacking structure with controllable stacking spacing

Abstract

The invention provides a preparation method of a multilayer substrate stacking structure with controllable stacking spacing, which belongs to the field of microwave circuits. The method comprises thefollowing steps of: obtaining target stacking spacing between an upper substrate and a lower substrate and a primary selection process parameter, the target stacking spacing being preset spacing between the lower surface of the upper substrate and the upper surface of the lower substrate, and the primary selection process parameter being at least one process parameter preset in a stacking process,determining an adjustment process parameter according to the target stacking spacing and the primary selection process parameter, the adjustment process parameter being used for influencing the height of a solder ball, implanting solder balls on a first bonding pad on the lower surface of the upper substrate based on the primary selection process parameters and the adjustment process parameters,and welding the solder balls on the first bonding pad on the second bonding pad on the upper surface of the lower substrate through reflow soldering. According to the preparation method provided by the invention, only each parameter needs to be acquired in advance and is correspondingly adjusted during operation, so that the target stacking spacing can be conveniently adjusted, and the resonant frequency of the virtual metal cavity is adjusted.

Description

technical field [0001] The invention belongs to the technical field of microwave circuits, and more specifically relates to a method for preparing a multilayer substrate stack structure with controllable stack spacing. Background technique [0002] With the rapid development of modern communication and radar system technology, the demand for miniaturized, low-cost, and highly reliable microwave radio frequency circuits is becoming increasingly urgent. Using stacking integration technology to layer circuit components on different circuit substrates is one of the important technical ways to realize the miniaturization of module circuits. For the stack integration technology, it is necessary to adjust the distance between the circuit substrates to adjust the electrical performance of the stack structure. [0003] At present, there are two main ways of stacking microwave circuit substrates. One is to support the metal aluminum frame, and then use insulators or wire bonding to r...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing a multi-layer substrate stack structure with controllable stack spacing, so as to solve the problem in the prior art of adjusting the spacing between substrates interconnected by solder balls in microwave radio frequency circuit structures technical issues of the method

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