Surface-mounted miniature superimposed circuit attenuation sheet and preparation method thereof

Abstract

The invention discloses a surface-mounted miniature superimposed circuit attenuation sheet and a preparation method thereof. The size of the attenuation sheet is 2.5 mm * 4mm * 0.635 mm, the front surface of the attenuation sheet is provided with a first attenuation circuit and a second attenuation circuit, the first attenuation circuit and the second attenuation circuit are connected in series, and the first attenuation circuit and the second attenuation circuit share one resistor. The two attenuation circuits are connected in series to obtain the attenuation circuit with a higher attenuationvalue, and the relative resistance value is smaller, so that the precision requirement can be better met; and the first attenuation circuit and the second attenuation circuit creatively share one resistor to form respective attenuation circuits, so that the size of the attenuation sheet is effectively reduced, the attenuation sheet is easier to arrange in a high-frequency circuit, and an end conductor of the attenuation sheet is machined at one time, thereby further improving the precision and quality of the attenuation sheet.

Description

technical field [0001] The invention belongs to the technical field of attenuators, in particular to a surface-mounted miniature superimposed circuit attenuator and a preparation method thereof. Background technique [0002] At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components. High-power ceramic load chips can only simply consume and absorb excess power, but cannot monitor the working conditions of the base station in real time. When the base station fails, it cannot be judged in time, and it has no protective effect on the equipment; the attenuator can not only absorb the reverse input power of the communication components in the communication base station, but also can extract part of the signals in the communication components, and carry out the analysis of the base station. Real-time monitoring can protect the equipment. [0003] In the 4G communication era, because the base station...

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Problems solved by technology

[0004] In addition, in the attenuator in the prior art, the conduction conductors of the front conductors and the back conductors are all completed by the side silver paste printing process, because the printing of the terminal conductors (side conductors) requires two clampings to separate them. To complete the conductor printing on both sides, the process is cumbersome and the printing flatness and thickness consistency of the thick film silver paste is not high, which makes it easy to generate an interference electric field in the attenuation circuit, or generate a large inductance, which affects the attenuation accuracy, and more seriously high frequency reflection

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