Method for producing film formation substrate, film formation substrate, and surface treatment agent
A surface treatment agent and surface treatment technology, which can be used in chemical/electrolytic methods to remove conductive materials, pre-treat surfaces, and manufacture printed circuits. Insufficient and other problems, to improve the effect of exudation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 approach
[0034] (First Embodiment: Method for Manufacturing a Film-Forming Substrate)
[0035] The method for producing a film-forming base material according to this embodiment is to produce a film-forming base material in which a film of a resin composition is formed on the surface of a metal base material, and includes: an etching step of etching the surface of the metal base material with a micro-etching agent; and a surface treatment step. , the surface treatment agent is brought into contact with the surface of the etched metal base material so that the contact angle of the metal base material surface with respect to water is 50° or more and 150° or less; and the film forming step is performed on the surface treated A film of the resin composition was formed on the surface of the metal substrate by inkjet.
[0036]
[0037] The film-forming base material produced by the production method of this embodiment is not particularly limited as long as it is a base material on which a ...
no. 2 approach
[0083] (Second Embodiment: Method for Manufacturing a Film-Forming Substrate)
[0084] Others The method for producing a film-forming base material according to this embodiment includes: an etching step of etching the surface of the metal base material with a micro-etchant; a surface treatment step of bringing the surface treatment agent into contact with the etched surface of the metal base material to make the metal base material surface treatment so that the contact angle of the surface with respect to the solder resist becomes 10° to 120°; and a film forming step of forming a film of the resin composition on the surface of the surface-treated metal substrate by inkjet.
[0085] In this embodiment, in the surface treatment step, a surface treatment agent is contacted, and the surface treatment agent can adjust the microetched metal base material so that the contact angle of the metal base material surface with respect to the solder resist becomes 10° or more and 120° or less...
no. 3 approach
[0089] (Third Embodiment: Manufacturing Method of Film Forming Substrate)
[0090] Others The method for producing a film-forming substrate according to this embodiment includes: a roughening step of mechanically roughening the surface of the metal substrate; a surface treatment step of bringing a surface treatment agent into contact with the roughened surface of the metal substrate to make the metal surface treatment so that the contact angle of the surface of the base material with respect to water is 50° to 150°; and a film forming step of forming a film of the resin composition on the surface of the surface-treated metal base material by inkjet.
[0091]
[0092] This embodiment is the same as that of the first embodiment except that the etching step in the manufacturing method of the first embodiment described above is changed to a roughening step.
[0093] In the roughening step, a fine concave-convex shape (roughened shape) is mechanically formed on the surface of the...
PUM
| Property | Measurement | Unit |
|---|---|---|
| surface roughness | aaaaa | aaaaa |
| surface roughness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More