High temperature probe and its preparation method and application

Abstract

The invention discloses a high-temperature probe as well as a preparation method and application thereof. The probe comprises a metal layer, four nickel wires, ceramic adhesive layers, an upper ceramic chip and a lower ceramic chip. The head of the metal layer has a planar double-helix structure formed by a metal thin strip from inside to outside, the two ends of the metal thin strip extend from the tail of the planar double-helix structure to the tail of the metal layer, and each end of the metal thin strip is provided with wo nickel strips in a dispersed manner; the head ends of the four nickel wires are respectively welded with the tail parts of the four nickel strips; the upper ceramic chip and the lower ceramic chip are arranged on the upper surface and the lower surface of the metallayer respectively, and the ceramic glue layers wrap the tail of the upper ceramic chip and the tail of the lower ceramic chip. The probe does not involve bonding of the upper ceramic chip and the lower ceramic chip, but is independent of each other, so that glue for bonding the upper ceramic chip and the lower ceramic chip together does not exist between the upper ceramic chip and the lower ceramic chip; the mutual damage of an insulating layer and a metal layer due to different thermal expansion coefficients at high temperature is avoided; and the probe can be recycled for multiple times.

Description

technical field [0001] The invention belongs to the technical field of probes, and in particular relates to a high-temperature probe and its preparation method and application. Background technique [0002] The thermal constant is an important heat transfer parameter of a substance. The study of the thermal constant of a substance not only has a wide range of research objects in academic theory, but also has very important applications in industrial practice. Accurate and reliable thermal conductivity is widely used in aerospace, chemical industry, construction, etc. It has very important guiding value in many fields such as agriculture and agriculture. The acquisition of material thermal constant is mainly divided into two methods: theoretical prediction and experimental measurement, and experimental measurement is further divided into steady state measurement method and transient measurement method. [0003] The main theoretical basis of the steady-state measurement metho...

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Problems solved by technology

This structure and processing technology will have the following consequences: Normally, the probes working in the low temperature section can be used continuously for many times and have a long life; however, the probes currently used in the high temperature section (the insulating layer is high-temperature ceramic glue) It must withstand thermal shock from room temperature to high temperature (up to 1000°C or even higher). When the test temperature is as high as 500°C, the stress caused by the difference in thermal expansion coefficient between the core material and the insulating layer will cause the probe to be used only a few times. 1 to 2 times, the lifespan is greatly shortened

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