Module packaging structure and packaging method thereof

Abstract

The invention discloses a module packaging structure and a packaging method thereof. The module packaging structure comprises a substrate used for bearing a chip. At least one fixing hole penetratingthrough an upper side surface and a lower side surface of the substrate is arranged in the substrate. And the packaging structure further comprises a first heat conduction pipe fixed in the fixing hole. The first heat conduction pipe comprises an exposed part which penetrates out of the fixing hole and is exposed out of the upper side surface of the substrate. The module packaging structure provided by the invention is provided with the first heat conduction pipe and the fixing hole so that simultaneous heat dissipation in an upper direction and a lower direction of the substrate can be realized, and meanwhile, the substrate can be subjected to heat dissipation, heat of the chip and the substrate can be quickly conducted to the outside of the module packaging structure, and overall heat dissipation performance of the module packaging structure is improved; and simultaneously, the first heat conduction pipe can be fixed by the fixing hole so that the first heat conduction pipe is firmerin the packaging structure.

Description

technical field [0001] The present invention relates to the technical field of electronic packaging, and more specifically, the present invention relates to a module packaging structure and a packaging method thereof. Background technique [0002] With the development of the times and the advancement of science and technology, the technology of integrated circuits is also continuously improved and developed. At the same time, the volume of products is continuously reduced, and the functions are continuously improved. The core of the work, that is, the packaging process of semiconductor dies is becoming more and more rigorous and important. The heat treatment of semiconductor chips and how to better dissipate heat have become very important design points in the integrated circuit and semiconductor packaging process. At present, the package heat dissipation structure in the prior art usually adopts laying a large number of heat pipes above the high-frequency chip to cool the ...

AI Technical Summary

Problems solved by technology

At present, the package heat dissipation structure in the prior art usually adopts laying a large number of heat pipes above the high-frequency chip to cool the high-frequency chip. This package structure generally has cumbersome manufacturing process, high production cost, single heat dissipation form, low heat dissipation efficiency, and at the same time The problem that the heat pipe is not firm in the packaging structure, and the existing technology only focuses on the heat dissipation of the chip, while ignoring the heat dissipation of the substrate, which makes it difficult to quickly release the heat of the substrate, which in turn affects the reliability of the module packaging structure. influences

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