Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED lamp bead preparation method

A technology of LED lamp beads and LED chips, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven light spots of LED lamp beads, achieve uniform light spots, increase brightness, and improve the uniformity of light output

Inactive Publication Date: 2020-04-24
JIANGXI LATTICEBRIGHT
View PDF10 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above deficiencies, the present invention provides a method for preparing LED lamp beads, which effectively solves the technical problem of uneven light spots of LED lamp beads

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED lamp bead preparation method
  • LED lamp bead preparation method
  • LED lamp bead preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In order to more clearly illustrate the implementation cases of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0021] like Figure 1~4 Shown is a schematic flow chart of an embodiment of the LED lamp bead preparation method provided by the present invention. As shown in the figure, the preparation method includes:

[0022] S10 Arrange the LED chips 2 on the surface of the substrate 1 according to rules, with the light-emitting side surface of the LED chips 2 facing upward, as figure 1 shown. Specifically, the shape and pitch of the arrangement of the LED chips 22 are adjusted ac...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LED lamp bead preparation method which comprises the following steps: S10, LED chips are regularly arranged on the surface of a substrate, and the light-emitting side surfaces of the LED chips face upwards; S20, silica gel is dispensed on the surfaces of the light-emitting sides of the LED chips; S30, fluorescent films cut into a preset size are sequentially attached to the surfaces of the LED chips to cover the light-emitting surfaces of the LED chips, and triangle-like silica gel layers are formed on the connecting interfaces of the fluorescent films and the LED chips; S40, high-reflection white glue fills the gaps between the LED chips until the high-reflection white glue is flush with the fluorescent films in height; and S50, cutting is carried out according to the cutting channels between the LED chips to obtain single LED lamp beads. Fluorescent powder covers the surfaces of the light-emitting sides of the LED chips in a film pasting mode, the light-emitting uniformity of LED lamp beads is improved, and the prepared LED lamp beads are uniform in light spot. The triangle-like silica gel layers are formed on the connection interfaces of the fluorescentfilms and the LED chips, so that the brightness of the LED lamp beads is greatly improved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a method for preparing LED lamp beads. Background technique [0002] In the process of packaging blue LED chips into white LED lamp beads, phosphor powder needs to be packaged on the surface of the blue LED chips to emit white light under the excitation of blue light. At present, the phosphor powder packaging methods include spot phosphor powder process and spray phosphor powder process, but these two processes will cause uneven phosphor powder on the surface or around the LED chip, resulting in uneven light spots of LED lamp beads. Contents of the invention [0003] In order to overcome the above disadvantages, the present invention provides a method for preparing LED lamp beads, which effectively solves the technical problem of uneven light spots of LED lamp beads. [0004] The technical scheme provided by the invention is: [0005] A method for preparing an LED lamp bead, com...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/50H01L33/54H01L33/60
CPCH01L33/505H01L33/54H01L33/60H01L2933/0041H01L2933/005H01L2933/0058
Inventor 江柳杨赵汉民
Owner JIANGXI LATTICEBRIGHT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com