Efficient welding mould for vapor chambers

Abstract

The invention relates to a mould, in particular to an efficient welding mould for vapor chambers. The efficient welding mould for the vapor chambers comprises a mould body, pressure plates and pressure rods, wherein the mould body is a hollow cubic body of which the two side vertical surfaces are provided with openings; the pressure plates are block-shaped objects which are consistent with the vapor chambers in size; and a plurality of screw holes are formed in the top surface of the mould body; the pressure rods pass through the screw holes, and then are in threaded connection to the top surface of the mould body. The efficient welding mould is simple in structure, and can weld multiple vapor chambers once through lamination and combination of multiple pressure plates and multiple vapor chambers; two mutually-perpendicular sides of each vapor chamber can be easily aligned to the two side walls of the mould body, so that occurrence of conditions such as defects and liquid leakage, caused by substandard welding quality generated by edge irregularity and positioning inaccuracy, in later-stage vacuum treatment is basically avoided. Meanwhile, while the vapor chambers and the mould areput into a high-temperature furnace to be heated, the two edges of the outer side of each vapor chamber are free of blockage, and thus can freely expand, so that problems such as swelling and deformation caused by inconsistent expansion coefficients are completely solved, and therefore, the welding quality of products is greatly improved.

Description

technical field [0001] The invention relates to a mold, in particular to a high-efficiency welding mold for a uniform temperature plate. Background technique [0002] As the chip functions of electronic devices become more and more powerful, the heat generation becomes more and more serious. Especially with the development of 5G communication network, 5G smartphones are developing in the direction of lightness, intelligence and multi-function. The integration level puts forward higher performance requirements and challenges to the heat dissipation treatment technology of mobile phone materials. The traditional heat dissipation technology can no longer meet the growing demand for power heat dissipation. At present, the relatively good heat dissipation technology can be said to be a vapor chamber. A vapor chamber is a heat diffuser that can quickly The heat will be taken away, which can avoid the heat from being concentrated on the heat source. The structure of the vapor cha...

AI Technical Summary

Problems solved by technology

There is a common problem in the industry that it is difficult to locate the upper and lower pieces. It is mainly manifested in the welding process. The thermal expansion coefficient of the copper alloy of the vapor chamber and the graphite material of the welding mold are quite different, and they cannot be synchronized at high temperatures. When the thermal expansion of the vapor chamber is large When blocked by a graphite mold with a small expansion degree, it is easy to produce bulges and deformations, resulting in poor welding. Therefore, there is an urgent need for a vapor chamber welding mold with good welding quality and high efficiency.

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