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3D printing method and device based on thermocuring mechanism

A 3D printing and thermal curing technology, applied in the field of 3D printing, can solve the problems of light intensity attenuation, shallow curing depth, and difficult liquid slurry curing and forming.

Pending Publication Date: 2020-04-28
SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] But for some cases, this method is very limited, for example: 1. The organic matter itself has a darker color and has a strong absorption characteristic for ultraviolet light. In this case, the light can only be irradiated to a very shallow depth; figure 1 and figure 2 2. Some 3D printing materials are slurry or paste of organic liquid and solid particles, and some solid particles are darker in color, or the proportion of solid particles Larger, and the solid particles themselves are not transparent substances, in this case, the curing depth of ultraviolet light in the slurry will also be very shallow
The above two conditions will make it difficult to solidify the liquid slurry by UV curing

Method used

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  • 3D printing method and device based on thermocuring mechanism
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Embodiment Construction

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the embodiments of the present application clearer, the following combination Figure 1 to Figure 3 And embodiment, this application is described in further detail. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

[0022] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying Any device or element must have a specific orientation, be constructed, and operate...

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Abstract

The embodiment of the invention discloses a 3D printing method and device based on a thermocuring mechanism. The 3D printing method comprises the step that a light source is used for irradiating liquid slurry which generates heat by absorbing light and is subjected to thermocuring according to a set path. The device comprises the light source, and the light source can irradiate the liquid slurry which generates heat by absorbing light and is subjected to thermocuring according to the set path. According to the embodiment, the liquid slurry is cured through a thermal initiation mode, and the curing depth can be increased.

Description

technical field [0001] The present application relates to the technical field of 3D printing, in particular to a 3D printing method and device based on a thermosetting mechanism. Background technique [0002] The conventional 3D printing method that selectively solidifies a liquid slurry into a solid state is generally a photocuring method. The organic matter of the liquid slurry is mixed with a photoinitiator to promote the polymerization of organic molecules, and the part receiving ultraviolet light is converted into a solid state. This method forms curing by means of light, so the area can be selected for curing by means of light. [0003] But for some cases, this method is very limited, for example: 1. The organic matter itself has a darker color and has a strong absorption characteristic for ultraviolet light. In this case, the light can only be irradiated to a very shallow depth; figure 1 and figure 2 2. Some 3D printing materials are slurry or paste of organic liq...

Claims

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Application Information

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IPC IPC(8): B29C64/135B29C64/277B33Y10/00B33Y30/00
CPCB29C64/135B29C64/277B33Y10/00B33Y30/00
Inventor 马建立李昕
Owner SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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