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Physical vapor deposition preparation method for high-entropy alloy film with uniform and controllable components

A physical vapor deposition, high-entropy alloy technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problem that high-entropy alloy target is difficult to control element content, difficult to obtain high-entropy coating with uniform composition, The problem of high production cost is to achieve the effect of controllable and uniform high-efficiency components, ingenious overall design ideas, and low production costs.

Inactive Publication Date: 2020-04-28
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high-entropy alloy target is difficult to control the element content, and the production cost is high; it is difficult to obtain a high-entropy coating with uniform composition using a single element independent target

Method used

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  • Physical vapor deposition preparation method for high-entropy alloy film with uniform and controllable components
  • Physical vapor deposition preparation method for high-entropy alloy film with uniform and controllable components
  • Physical vapor deposition preparation method for high-entropy alloy film with uniform and controllable components

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preparation example Construction

[0032] As an aspect of the technical solution of the present invention, it relates to a physical vapor deposition preparation method of a high-entropy alloy film with uniform and controllable composition, which includes:

[0033] Using magnetron sputtering technology, using a magnetron sputtering composite target as the target material, using one or more than two gases as the working gas, a negative bias is applied to the substrate, so that a uniform and controllable high-entropy composition can be deposited on the surface of the substrate. Alloy thin film, the working gas contains at least a protective gas;

[0034] Wherein, the magnetron sputtering composite target includes at least one target period arranged periodically in the vertical direction, and each target period includes a plurality of single alloy targets stacked in sequence in the vertical direction.

[0035] Furthermore, in the present invention, the pure element targets are arranged and combined in a certain ord...

Embodiment 1

[0070] In this embodiment, the substrate material is 304 stainless steel, and the surface of the substrate is an amorphous VAlTiCrSi high-entropy alloy thin film.

[0071] The preparation method of this VAlTiCrSi high-entropy alloy thin film is as follows:

[0072] Using magnetron sputtering technology to prepare a VAlTiCrSi high-entropy alloy film on the surface of the substrate mainly includes the following steps:

[0073] (1) if figure 2 As shown, select V target, Al target, Ti target, Cr target, and Si target, and stack and arrange each target with a thickness of 10 mm in the order of V-Al-Ti-Cr-Si in the vertical direction from top to bottom to form One target period; then, including 12 said target periods in the vertical direction, forming a composite target.

[0074] (2) Perform mechanical grinding and polishing on the surface of the substrate, ultrasonically clean it three times with petroleum ether, acetone and alcohol, and then dry it with flowing nitrogen; then, ...

Embodiment 2

[0083] In this embodiment, the substrate material is 304 stainless steel, and the surface of the substrate is a VAlTiCrCu high-entropy alloy thin film with a BCC structure.

[0084] The preparation method of this VAlTiCrCu high-entropy alloy thin film is as follows:

[0085] Using magnetron sputtering technology to prepare a VAlTiCrCu high-entropy alloy film on the surface of the substrate mainly includes the following steps:

[0086] (1) if Figure 4 As shown, select V target, Al target, Ti target, Cr target, and Cu target, and stack and arrange each target with a thickness of 10 mm in the order of V-Al-Ti-Cr-Cu in the vertical direction from top to bottom to form One target period; then, including 12 said target periods in the vertical direction, forming a composite target.

[0087] (2) Perform mechanical grinding and polishing on the surface of the substrate, ultrasonically clean it three times with petroleum ether, acetone and alcohol, and then dry it with flowing nitrog...

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Abstract

The invention discloses a physical vapor deposition preparation method for a high-entropy alloy film with uniform and controllable components. The preparation method comprises the steps that a magnetron sputtering technology is adopted, a magnetron sputtering composite target serves as a target material, one or more kinds of gas serve as working gas, negative bias voltage is applied to a base body, and therefore the high-entropy alloy thin film with the uniform and controllable components is obtained on the surface of the base body through deposition; and the magnetron sputtering composite target comprises at least one target period which is periodically arranged in the vertical direction, and each target period comprises single alloy target materials which are sequentially stacked in thevertical direction. According to the provided preparation method, the method is simple, the overall design idea is ingenious, all pure targets are independent of one another and are flexible and convenient to combine, the adjustment can be carried out according to needs, and the high-entropy alloy thin film with the controllable and uniform components can be economically and efficiently prepared;and according to the method, the thin-layer target materials are stacked and spliced together, so that compared with combination of large pure target materials, the method can enable various components in a product to be uniform, so that the product with a single phase is obtained.

Description

technical field [0001] The invention relates to the preparation of a high-entropy alloy thin film, in particular to a method for preparing a high-entropy alloy thin film (coating) by physical vapor deposition with uniform and controllable composition, and belongs to the technical field of surface treatment. Background technique [0002] High-entropy alloy is a new type of alloy that is different from traditional alloys, adding auxiliary elements as principal elements, and containing five or more elements. Studies have shown that high-entropy alloys have simple structures and are easy to form simple face-centered cubic, body-centered cubic or amorphous phases. High-entropy alloys have excellent properties such as high hardness, high strength, wear resistance, and corrosion resistance. But to make the high-entropy alloy with high unit price, low output and good performance play the greatest role, it is the best choice as a thin film (coating) material. Therefore, high-entrop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/14
CPCC23C14/14C23C14/3407C23C14/35C23C14/352
Inventor 蒲吉斌郑淑璟蔡召兵王立平薛群基
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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