Pressure-assisted silver sintering device for power semiconductor chips

Abstract

A pressure-assisted silver sintering device for power semiconductor chips, comprising nano-silver film transfer tooling and silver sintering tooling. The nano-silver film transfer tooling is used to attach the nano-silver film to the gasket, on which there is a first pressure relief structure for releasing the internal stress of the tooling due to uneven heating during the nano-silver film transfer process. The silver sintering tooling is used for silver sintering the gasket and the chip with the nano-silver film attached, and there is a second pressure relief structure for releasing the internal stress of the tooling due to uneven heating during the silver sintering packaging process. Since the nano-silver film transfer tooling and the silver sintering tooling are provided with a pressure relief structure, the deformation of the metal components in the tooling during the heat treatment process of the silver sintering package of the chip can be avoided, thereby improving the sintering package efficiency of the chip.

Description

technical field [0001] The invention relates to the technical field of silver sintering, in particular to a pressure-assisted silver sintering tooling for power semiconductor chips. Background technique [0002] In the existing silver sintering packaging process, when the chip area is greater than 25mm 2 At the same time, the pressure-assisted silver sintering process is often used, and the nano-silver transfer film is often used to achieve rapid sintering of chips and pads. The above process mainly includes the transfer of nano-silver film to the chip or spacer, the alignment between the transferred film chip (or spacer) and the spacer (or chip), and the sintering of the chip and the spacer by external pressure at high temperature. One. [0003] The above process needs to be realized with the help of specific tooling. The role of the tooling is mainly reflected in two aspects. One is to apply the pressure required for sintering between the chip and the pad; the other is t...

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the invention is: in the traditional heat treatment process of silver sintering, due to the difference between the thermal conductivity and the thermal expansion coefficient between the multi-layer metal positioning frames, the deformation of the silver sintering tool will be caused, resulting in the chip being damaged during the heat treatment process. or shims move

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