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Ceramic electronic component

A technology of electronic components and ceramics, applied in the field of ceramic electronic components

Active Publication Date: 2020-05-01
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the conductive resin layer has high resistance, and products using the conductive resin layer may have a problem of high equivalent series resistance (ESR) compared to products without the conductive resin layer

Method used

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  • Ceramic electronic component
  • Ceramic electronic component
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Examples

Experimental program
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Embodiment Construction

[0019] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings as follows.

[0020] This disclosure, however, may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clarity of description, and elements indicated by the same reference numerals in the drawings are the same elements.

[0021] In the drawings, some elements may be omitted to allow the present disclosure to be clearly described, and thicknesses may be exaggerated in order to clearly express layers and regions. The same elements having the same function within the scope of the same concept will be described using the same reference numeral...

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Abstract

The invention provides a ceramic electronic component which comprises: a body which includes a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer therebetween, first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected tothe first to fourth surfaces and opposing each other; a first external electrode which includes a first electrode layer connected to the first internal electrode and a first conductive resin layer disposed on the first electrode layer, and is disposed on the third surface of the body; and a second external electrode which includes a second electrode layer connected to the second internal electrode and a second conductive resin layer disposed on the second electrode layer, and is disposed on the fourth surface of the body.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2018-0127579 filed on October 24, 2018 at the Korean Intellectual Property Office, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a ceramic electronic component. Background technique [0003] Multilayer ceramic capacitors (MLCCs) are mounted on printed circuit boards of various electronic products such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, cellular phones, etc. charge and discharge chip capacitors. [0004] Since the multilayer ceramic capacitor is relatively small in size and capable of securing high capacity and easy mounting, the multilayer ceramic capacitor may be used as a component of various electronic devices. As electronic devices such as computers, mobile devices, etc. have been miniaturized and power h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/232H01G4/12H01G4/30
CPCH01G4/1209H01G4/232H01G4/2325H01G4/30H01G4/012H01G4/12H01G4/1227H01G4/252H01G4/0085
Inventor 申东辉金度延朴祥秀申旴澈
Owner SAMSUNG ELECTRO MECHANICS CO LTD