A method of forming metal electrodes in a packaging process
A metal electrode and package technology, applied in the field of electronics, can solve the problems of large metal demand, restrictions, and large investment, and achieve the effects of improving production efficiency, simple structure, and reducing costs
Active Publication Date: 2021-08-31
深圳市鼎华芯泰科技有限公司
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As far as packaging technology is concerned, the mainstream packaging technology mostly adopts the HDI technology route, and its core lies in the formation of micro-hole conduction and thin lines. However, the equipment and technology threshold of this technology route is high, and the investment is large, and it needs to be matched with a dedicated carrier substrate. , and the size and thickness are limited by material specifications, and the method of forming electrodes has a very large demand for metal
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] Features and advantages of the invention will become apparent from the more particular description of preferred embodiments of the invention, illustrated in the accompanying drawings, which follow.
[0033] see Picture 1-1 , in one embodiment, it discloses a method for forming a metal electrode in an encapsulation process, comprising the steps of:
[0034] S100: Select a carrier sheet as a package carrier for carrying a package, wherein the carrier sheet can be peeled off relative to the package and reused for the package carrier;
[0035] S200: Process the carrier sheet so that a part of the carrier sheet forms a first region where a dielectric is attached that is thinner than the carrier sheet, and enables at least another part of the carrier sheet to be electroplated to form a second region where a metal electrode is attached; Wherein, when the carrier sheet is peeled off from the package body, the metal electrode belongs to the package body; the medium includes any...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present disclosure relates to a method for forming metal electrodes in a packaging process, which includes the following steps: S100: Select a carrier sheet as a package carrier for carrying a package, wherein the carrier sheet can be peeled off relative to the package and reused for The packaging carrier; S200: processing the carrier sheet, so that a part of the carrier sheet forms a first region where a dielectric is attached that is thinner than the carrier sheet, and enables at least another part of the carrier sheet to be electroplated to form a metal electrode The second area of attachment; wherein, when the carrier sheet is peeled off from the package, the metal electrode belongs to the package; the medium includes any of the following: release film, transition coating, or other A medium that can form a weak bond with the package or carrier. In this way, the present disclosure realizes a simpler, more environmentally friendly, and lower-cost method for forming metal electrodes in the packaging process and its supporting process.
Description
technical field [0001] The disclosure belongs to the field of electronics, and in particular relates to a method for forming metal electrodes during packaging. Background technique [0002] The integrated circuit industry is the basic and leading industry of the information society, among which, the packaging and testing of various integrated circuits is an important link in the entire industrial chain. As far as packaging technology is concerned, the mainstream packaging technology mostly adopts the HDI technology route, the core of which lies in the formation of micro-hole conduction and thin lines. However, the equipment and technology threshold of this technology route is high, and the investment is large, and it needs to be matched with a special carrier substrate. , and the size and thickness are limited by the material specifications, and the method of forming the electrode has a very large demand for metal. [0003] How to design a simpler, more environmentally frie...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L21/48
CPCH01L21/4846H01L21/561H01L2224/48091H01L2924/181H01L2924/00012H01L2924/00014
Inventor 何雨桐何忠亮张旭东徐光泽李金样
Owner 深圳市鼎华芯泰科技有限公司