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Optical integrated device

An integrated device and optical technology, which is applied in radiation control devices, printing image acquisition, character and pattern recognition, etc., can solve the problems of large size and volume, occupying a large space, etc., and achieve smaller focal length, compact size and size, The effect of small thickness

Pending Publication Date: 2020-05-05
SHENZHEN FUSHI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limited internal space of electronic equipment such as mobile phones, and the imaging device that uses traditional lenses to achieve optical imaging due to its large size and volume, it takes up a lot of space. It is necessary to provide a device for imaging with a smaller volume

Method used

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Embodiment Construction

[0038] In the detailed description of embodiments of the present application, it will be understood that when a substrate, sheet, layer or pattern is referred to as being "on" or "under" another substrate, sheet, layer or pattern, it It may be "directly" or "indirectly" on another substrate, another sheet, another layer or another pattern, or one or more intervening layers may also be present. The thickness and size of each layer in the drawings of the specification may be exaggerated, omitted or schematically represented for the purpose of clarity. Furthermore, the sizes of elements in the drawings do not fully reflect actual sizes.

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the...

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Abstract

The invention discloses an optical integrated device. The optical integrated device comprises a wafer which comprises a plurality of first image sensing bare chips, wherein each first image sensing bare chip comprises a plurality of pixel units used for receiving light beams and converting the received light beams into corresponding electric signals so as to obtain fingerprint information of an external object; and a plurality of lens modules arranged opposite to the plurality of first image sensing bare chips one by one. Each lens module comprises a plurality of mini-lenses which are arrangedon the first image sensing bare chip, wherein the plurality of mini-lenses are arranged at intervals, each mini-lens directly faces the plurality of pixel units, and the mini-lenses are used for converging light beams to the pixel units; and a shading part which is arranged on the first image sensing bare chip, the shading part is located in a spacing area among the plurality of mini-lenses and is not shorter than the mini-lenses in height, or is shorter than the mini-lenses but not shorter than 10 microns or more, and the shading part is used for shading the light beams.

Description

technical field [0001] The present application relates to the field of optoelectronic technology, and in particular, to an optical integrated device with ultra-thin dimensions. Background technique [0002] With the advancement of technology and the improvement of people's living standards, users require more functions and stylish appearance for electronic devices such as mobile phones, tablet computers, and cameras. At present, the development trend of electronic devices such as mobile phones is to have a high screen ratio and to have functions such as fingerprint detection. In order to achieve a full-screen or near-full-screen effect and make electronic devices have a high screen-to-body ratio, under-screen fingerprint detection technology came into being. Since the internal space of electronic devices such as mobile phones is limited, and the imaging device using traditional lenses to realize optical imaging takes up a large space due to its large size and volume, it is ...

Claims

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Application Information

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IPC IPC(8): H01L27/146G06K9/00
CPCH01L27/14627H01L27/14623H01L27/14687H01L27/14685G06V40/1324G06V40/1318
Inventor 董佳群林峰
Owner SHENZHEN FUSHI TECH CO LTD
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