Lead frame feeding frame with automatic fixing function

Abstract

The invention discloses a lead frame feeding frame with an automatic fixing function. The frame comprises an outer frame, a plurality of cavities with a same structure are arranged in the outer frame,and an inner frame is arranged in each cavity; and fixing seats are arranged at four corners of the frame and a joint of a transverse connecting rod and the frame, and a rotatable rotating rod is arranged in the direction of the transverse connecting rod. One end of the rotating rod is movably connected to the fixed seats, and the other end sequentially penetrates through the fixed seats arrangedin parallel and extends out. One end of the rotating rod is provided with a reset spring and provided with a touch rod capable of driving the rotating rod to rotate. The inner frame is provided witha plurality of first top sheets and second top sheets used for supporting a lead frame. The rotating rod is provided with pressing blocks capable of making contact with the first top sheets corresponding to the multiple first top sheets, and the pressing blocks can rotate along with the rotating rod. The feeding frame can effectively avoid dislocation and deformation of the lead frame in a processof transferring the feeding frame to a plastic package mold, production cost and operation intensity of workers are reduced, and production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a lead frame feeding rack with an automatic fixing function. Background technique [0002] As the chip carrier of semiconductor integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. It plays the role of a bridge connecting with external wires. Most semiconductor integrated circuits need to use lead frames, which is an important basic material in the electronic information industry. [0003] With the vigorous development of the electronics industry, in the back-end packaging process of semiconductor products, especially integrated circuit chips, in order to facilitate the access and transmission of lead frames, it is necessary to arrange the lead...

AI Technical Summary

Problems solved by technology

[0006] In view of the deficiencies of the above-mentioned prior art, the object of the present invention is to provide a lead frame loading rack with an automatic fixing function, aiming at solving the problem of misalignment and deformation of the lead frame during the transfer of the loading rack to the plastic sealing mold. question

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