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Electronic device

A technology for electronic equipment and electronic components, which is applied to the structural parts of electrical equipment, electrical components, and modification using liquid cooling, etc. It can solve the problems of limited functions of electronic equipment, poor thermal conductivity of air, and difficulty in meeting rapid heat dissipation.

Inactive Publication Date: 2020-05-08
SHENZHEN CONTINENTS WIRELESS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, most of the market uses natural cooling to dissipate heat. This method transfers the heat generated by electronic components to the surrounding air to take away the heat generated by electronic components. However, due to the poor thermal conductivity of air, Therefore, it is difficult to meet the needs of rapid heat dissipation, and electronic equipment that adopts this method of heat dissipation cannot be equipped with high-power electronic components, resulting in limited functions of electronic equipment

Method used

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application.

[0025] The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the prese...

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Abstract

The invention discloses an electronic device which comprises a shell, a main board, an electronic component and a heat dissipation assembly. The main board and the heat dissipation assembly are fixedin the shell, and the electronic component is electrically connected with the main board; the heat dissipation assembly comprises a heat conduction box body, a phase change material and a first heat conduction piece; the heat conduction box body is fixed in the shell, and the phase change material is loaded in the heat conduction box body; and one end of the first heat conduction piece is connected with the electronic component, the other end of the first heat conduction piece is connected with the heat conduction box body, the first heat conduction piece conducts heat of the electronic component to the heat conduction box body, the heat conduction box body transmits the heat to the phase change material, and the phase change material absorbs the heat. The electronic equipment has an advantage of good heat dissipation performance, and the heat dissipation effect can be effectively improved by arranging the heat conduction box body and the phase change material in the heat conduction box body.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to an electronic equipment with good heat dissipation function and a heat dissipation device thereof. Background technique [0002] The electronic components of electronic equipment, such as capacitors, diodes, transistors, power supplies, processors, etc., will generate heat when they are working. If the heat is not dissipated in time, that is, the electronic components cannot be cooled in time, and the heat of electronic components will accumulate. And work in an abnormal working temperature range, such as working in a high temperature environment, after a certain period of time, electronic components will be damaged. At present, most of the market uses natural cooling to dissipate heat. This method transfers the heat generated by electronic components to the surrounding air to take away the heat generated by electronic components. However, due to the poor thermal con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/2039H05K7/20409
Inventor 刘庆龙高益仟
Owner SHENZHEN CONTINENTS WIRELESS TECH CO LTD