Pre-wetting equipment, pre-wetting system and pretreatment method for wafer pre-wetting

A pre-wetting, equipment technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem that both sides of the wafer cannot be processed at the same time

Pending Publication Date: 2020-05-12
新阳硅密(上海)半导体技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a pre-wetting equipment, a pre-wetting system and a wafer pre-wetting system in order to overcome the defect that the two sides of the wafer cannot be treated simultaneously in the pre-wetting pretreatment in the prior art. The preprocessing method

Method used

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  • Pre-wetting equipment, pre-wetting system and pretreatment method for wafer pre-wetting
  • Pre-wetting equipment, pre-wetting system and pretreatment method for wafer pre-wetting
  • Pre-wetting equipment, pre-wetting system and pretreatment method for wafer pre-wetting

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Embodiment 1

[0131] Such as Figure 1-Figure 6 As shown, the present embodiment is a kind of pre-wetting equipment 100, which is used for pre-wetting of wafer 91. In order to pass through the pre-wetting liquid, the pre-wetting device 100 also includes a clamping part 20, which is arranged inside the accommodating chamber 12, and the clamping part 20 is used to clamp the outer surface of the wafer 91, so as to Wafer 91 is submerged in a pre-wetting liquid. In this embodiment, the wafer 91 is clamped by the clamping part 20 provided in the accommodating chamber 12, and then the pre-wetting liquid is filled into the accommodating chamber 12, thereby immersing the wafer 91 in the pre-wetting liquid, and then Both sides of the wafer 91 can be wetted by the pre-wetting liquid. The pre-wetting equipment 100 of this embodiment has a simple structure, and can achieve wetting of both sides of the wafer 91 at one time, which is beneficial to improving the pre-wetting efficiency of the wafer 91 . ...

Embodiment 2

[0157] Such as Figure 7-Figure 9 As shown, the present embodiment is a pre-wetting system 400, and the pre-wetting system 400 includes the pre-wetting device 100 as in the first embodiment. For ease of description, this embodiment continues to use the reference numerals in Embodiment 1. In this embodiment, by using the pre-wetting device 100 , the two sides of the wafer 91 can be wetted by the pre-wetting liquid at the same time, which is beneficial to improve the pre-treatment efficiency of the pre-wetting of the wafer 91 .

[0158] As a preferred embodiment, the pre-wetting system 400 may also include an air extraction device 41 and a liquid storage tank 50, the air extraction device 41 communicates with the pre-wetting device 100; the liquid storage tank 50 is used to store the pre-wetting Liquid, the liquid storage tank 50 communicates with the pre-wetting device 100 through pipes. In this embodiment, the liquid storage tank 50 is used to provide the pre-wetting liquid,...

Embodiment 3

[0172] Such as Figure 10 As shown, the present embodiment is a pre-wetting pre-treatment method for the wafer 91 , and the pre-wetting system 400 as in the second embodiment is used in the pre-treatment method. For ease of description, this embodiment continues to use the reference numerals in Embodiment 1 and Embodiment 2. In this embodiment, by using the pre-wetting system 400 , the two sides of the wafer 91 can be wetted by the pre-wetting liquid at the same time, which is beneficial to improve the pre-wetting efficiency of the wafer 91 .

[0173] As a preferred embodiment, the pretreatment method may include: S10: Open the first box 11, and put the wafer 91 into the clamping part 20; S20: Put the pre-wetting liquid from the reservoir of the pre-wetting system The liquid tank 50 is transported into the first box 11; S30: the wafer 91 is immersed in the pre-wetting liquid. This embodiment is beneficial to simplify the operation steps of the pre-wet pretreatment of the waf...

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Abstract

The invention discloses pre-wetting equipment, a pre-wetting system and a pretreatment method for wafer pre-wetting. The pre-wetting equipment is used for pre-wetting a wafer. The pre-wetting equipment comprises a first box body, and a containing cavity is formed in the first box body; the containing cavity is used for introducing pre-wetting liquid, and the pre-wetting equipment further comprisesa clamping part, wherein the clamping part is arranged in the containing cavity, and the clamping part is used for clamping the outer circle face of a wafer so that the wafer can be immersed in the pre-wetting liquid. According to the invention, the wafer is clamped by the clamping part arranged in the containing cavity, and the containing cavity is filled with the pre-wetting liquid, so the wafer is immersed in the pre-wetting liquid, and the two side surfaces of the wafer can be wetted by the pre-wetting liquid. The pre-wetting equipment is simple in structure, wetting of the two side facesof the wafer can be achieved at a time, and the pre-wetting pretreatment efficiency of the wafer can be improved.

Description

technical field [0001] The invention relates to the field of wafer preparation, in particular to a pre-wetting device, a pre-wetting system and a pre-treatment method for wafer pre-wetting. Background technique [0002] Before the wafer is plated, it is usually necessary to pre-wet the wafer. Pre-wetting is beneficial to improve the electroplating quality of wafers. For wafers with characteristics such as large aspect ratios, such as wafers with TSV grooves, the effect of pre-wetting to improve wafer electroplating quality is more obvious. If the wafer is not pre-wetted before electroplating, during the electroplating process, due to the surface tension of the electroplating solution, gas bubbles are easily formed at the solid-liquid interface between the electroplating solution and the wafer surface, which will cause wafer cracking. The metallization pinches off, leaving voids at the bottom of the features on the wafer causing defects, such as blocked circuit lines. [00...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67011H01L21/67017H01L21/0201
Inventor 史蒂文·贺·汪
Owner 新阳硅密(上海)半导体技术有限公司
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