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439 results about "De wetting" patented technology

Super-hydrophobic porous membrane as well as preparation method and application thereof

The invention discloses a super-hydrophobic porous membrane as well as a preparation method thereof. A micro molding technology and a phase separation technology are combined, a membrane scraping bottom plate on which a membrane casting solution is scraped is placed in a water bath at the preset temperature for phase separation membrane formation, a formed membrane material is stripped, and the super-hydrophobic porous membrane is obtained. The membrane scraping bottom plate is a grooved soft template produced with a reverse mold process, the super-hydrophobic porous membrane produced throughthe grooved soft template comprises micron-size surface bulges which are consistent in size and arranged regularly, and the distance between adjacent surface bulges is micron-sized. The surface morphology of the membrane material is reconstructed, the super-hydrophobic porous membrane with multiple scales is prepared while additional modifiers are not added, and the super-hydrophobic porous membrane can be applied to a membrane distillation technology, has the advantages of high hydrophobicity, pollution resistance, wetting resistance and the like and thus has high salt resistance, and a novelmembrane production technology is provided for industrialization of membrane distillation and is low in cost and prone to mass production.
Owner:SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI +1

Programmable control micro-fluidic chip based on liquid-liquid electrowetting effect

The invention provides a programmable control micro-fluidic chip based on a liquid-liquid electrowetting effect. The programmable control micro-fluidic chip comprises a lower substrate, a drive electrode array, a lower substrate hydrophobic insulating layer, at least one liquid drop, an upper substrate hydrophobic layer, a conductive layer and an upper substrate from bottom to top, wherein cofferdams are added to the peripheries of the upper substrate and the lower substrate to form a closed cavity. The hydrophobic insulating layer is formed by a porous polymer film and a liquid capable of improving electric wettability and has the advantages of being good in electric wetting reversibility, reusable and resistant to voltage breakdown, high temperature and chemical reagents, the effect of the hydrophobic insulating layer is not affected after long-time storage, so that the service life of a device is prolonged, the efficiency of the device is improved, and the application range of the device is broadened; besides, the pressing mode of the drive electrode array can be programmed, therefore, operation processes such as rapid movement, combination, reaction and the like of different liquid drops are executed in different positions according to preset parameters.
Owner:INT ACAD OF OPTOELECTRONICS AT ZHAOQING SOUTH CHINA NORMAL UNIV

Precision electroplated solder bumps and method for manufacturing thereof

A method for fabrication of a solder bump, comprising applying preferably an insulating film, followed by applying a multilayer underbump metallization, a layer of a photoresist, and a thin layer of titanium on a substrate containing, preferably, III-V semiconductor circuits. The multilayer UBM pad, preferably comprising a 0.02 to 0.05 micrometer thick layer of titanium, a 0.5 to 1.0 micrometer thick layer of nickel and a 0.1 to 0.2 thick layer of gold. The protective film with the thickness of preferably 0.5 to 40 micrometer comprises a photoresist. After the solder has been electroplated, the protective film is removed, preferably by dry etching or with a solvent. The titanium film serves a dual function of being a membrane for electroplating of the solder and of being a non-wettable dam for wetting back of the plated solder. The titanium film with the thickness of 200 to 1,000 Angstroms is preferably deposited by evaporation. After the solder has been electroplated, much of the titanium film is removed, preferably by wet etching or dry etching, leaving only a band of titanium that surrounds the disk of solder. A multilayer solder bump structure for III-V semiconductor circuits manufactured using this method, comprising, preferably, an insulating film, a multilayer underbump metallization layer, and remnants of the thin titanium film.
Owner:HRL LAB
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