A kind of manufacturing method of pure copper circuit
A production method and circuit technology, which is applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve problems such as low production efficiency of laser cutting, inability to make pure copper foil, and carbonization of circuit edges. Achieve the effect of improving the production yield of the line, avoiding serious carbonization, and improving the bonding force
Active Publication Date: 2021-06-11
XIAMEN HONGXIN ELECTRON TECH
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Problems solved by technology
[0002] Some application fields of flexible circuit boards, such as RFID tags, etc., require the use of pure copper lines, such as figure 1 Shown is a pure copper circuit made of a layer of pure copper foil, pure copper foil, that is, a copper foil with only one layer of copper and no base material, pure copper foil cannot be produced by the ordinary single-sided FPC production method, if It is made by laser cutting process, the edge of the circuit is seriously carbonized, it is not easy to clean, and the production efficiency of laser cutting is low. Therefore, it is necessary to research and develop the production process of pure copper circuit
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[0023] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.
[0024] Such as figure 2 Cooperate Figure 4 Shown, the present invention is a kind of manufacturing method of pure copper circuit, and its manufacturing process is as follows:
[0025] Step A: Pure copper foil blanking, cutting the pure copper foil 1 according to the size required for making the panel;
[0026] Step B: paste the carrier film, and attach the carrier film 2 on the first side 11 of the pure copper foil;
[0027] Step C: laminating dry film, laminating dry film 3 on the second side 12 of pure copper foil;
[0028] Step D: line exposure, the line exposure is transferred on the dry film 3;
[0029] Step E: DES, performing DES treatment, that is, developing, etching, stripping, and forming the pure copper circuit 100;
[0030] Step F: Peel off the carrier film, remove the carrier film 2 , and le...
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The invention discloses a manufacturing method of a pure copper circuit, which comprises pure copper foil blanking, pasting a carrier film, dry film lamination, line exposure, DES, and peeling off the carrier film. On one side, it is simulated as a single-sided substrate copper foil to protect the pure copper foil, so that pure copper can be etched on the DES line; the viscosity of the carrier film used can be peeled and attached to the copper surface without glue transfer on the copper surface , to ensure that the appearance of the circuit is OK; the invention enables the pure copper circuit to be realized by the etching process, which can be etched in one time, and the production efficiency and product yield are improved.
Description
technical field [0001] The invention relates to the technical field of manufacturing flexible circuit boards, in particular to a method for manufacturing pure copper circuits. Background technique [0002] Some application fields of flexible circuit boards, such as RFID tags, etc., require the use of pure copper lines, such as figure 1 Shown is a pure copper circuit made of a layer of pure copper foil, pure copper foil, that is, a copper foil with only one layer of copper and no base material, pure copper foil cannot be produced by the ordinary single-sided FPC production method, if It is made by laser cutting process, the edge of the circuit is seriously carbonized, it is not easy to clean, and the production efficiency of laser cutting is low. Therefore, it is necessary to research and develop the production process of pure copper circuit. [0003] In view of this, the designer has made in-depth ideas on the many shortcomings and inconveniences caused by the imperfect pro...
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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/0052H05K3/06
Inventor 续振林陈妙芳许燕辉
Owner XIAMEN HONGXIN ELECTRON TECH