Printing device and frame encapsulating frit printing device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- ORDOS YUANSHENG OPTOELECTRONICS
- Publication Date
- 2020-05-19
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of display panel preparation, and in particular relates to a printing device and a sealing glue printing device. Background technique
[0002] Currently, Organic Light-Emitting Diode (Organic Light-Emitting Diode;
[0003] One of the encapsulation methods adopted by OLED) display substrates is glass glue (frit) encapsulation. In this packaging method, a circle of glass glue is printed around the display area (edge) of the display substrate by screen printing to form a sealant pattern, and then the cover plate and the display substrate with the pattern of the sealant pattern are vacuum-boxed, and then The organic matter in the glass glue is removed by baking, and then the vacuum-bonded packaging substrate and the display substrate are bonded together by melting and bonding the glass glue through laser sintering. Specifically, in the prior art, the screen printing process uses a scraper to squeeze the mask, ...