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Micromechanical component

A micro-mechanical structure and component technology, applied in the direction of micro-structure technology, micro-structure devices, manufacturing micro-structure devices, etc., can solve problems such as poor sensing performance, and achieve improved sensing performance, large capacitance area, and small arching Effect

Pending Publication Date: 2020-05-22
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Structures formed from metal oxide stacks have the disadvantage that the typical thickness of the individual functional layers is only in the range of 1 μm or less
As a result, significantly worse sensing properties are obtained compared to micromechanical structural elements consisting of silicon layers

Method used

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Examples

Experimental program
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Embodiment Construction

[0043] figure 1 , 2 A known micromachined z-acceleration sensor 100 is shown in which, figure 2 showing along figure 1 Simplified cross-sectional view of connecting line A-B in , through a plane extending perpendicular to the substrate. It can be seen that the bottom electrodes 11 , 12 formed in the first micromechanical functional layer 10 are arranged on a first oxide layer which is arranged on the substrate. Furthermore, an asymmetrically designed seismic mass in the form of a rocker can be seen, which is designed to be twistable about the torsion axis 33 . In this case, the additional mass 35 results in an asymmetrical configuration of the seismic mass.

[0044] This standard rocker structure is simple in design and widely used, but has the technical problem of making it difficult for applications with very high bias stability requirements. Significant limitations in bias stability can be caused by parasitic electrostatic effects, which are explained below.

[004...

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PUM

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Abstract

The invention relates to a micromechanical component having a movable seismic mass developed in a second and third silicon functional layer, a hollow body being developed in the second and third silicon functional layers, which has a cover element developed in a fourth silicon functional layer.

Description

technical field [0001] The invention relates to a micromechanical structural element. Furthermore, the invention relates to a method for producing a micromechanical component. Background technique [0002] Micromechanical structural elements, such as inertial sensors for measuring acceleration and rotational speed, are mass-produced for different applications in the automotive and consumer sectors. Preferably, a rocker structure is used for capacitive acceleration sensors with a detection direction perpendicular to the wafer plane (ie in the z-direction). The sensor principle of the rocker is based on a spring-mass system in which, in the simplest case, a movable oscillating mass with two counter electrodes fastened to a substrate forms two plate capacitors. The seismic mass is connected to the base via at least one, usually two torsion springs for reasons of symmetry. If the mass structure is of different sizes on both sides of the torsion spring, the mass structure rota...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B3/00B81B7/02B81C1/00G01H11/06
CPCB81C1/00269B81C1/00301B81B7/02B81B3/0035G01H11/06B81B2201/0235G01C19/5733G01P15/125B81B3/0086B81B2203/058B81B2203/0163B81B2203/0181G01P15/0802B81B3/007B81B5/00B81B2201/0242B81B2203/01G01C19/5747G01P2015/0805
Inventor J·克拉森L·格格
Owner ROBERT BOSCH GMBH