Vapor chamber manufacturing method and vapor chamber structure
A manufacturing method and vapor chamber technology, applied to lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of long production time, reduce costs, increase production capacity, etc., and achieve the goals of shortening production time, reducing costs, and increasing production capacity Effect
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no. 1 example
[0024] see Figure 1 to Figure 3 , which is a preferred embodiment of the present invention. What needs to be explained first is that this embodiment corresponds to the relevant quantities and shapes mentioned in the drawings, which are only used to specifically illustrate the implementation of the present invention, so as to facilitate understanding of its content , not to limit the protection scope of the present invention.
[0025] The invention provides a method for manufacturing a vapor chamber, comprising the following steps:
[0026] First of all, a first metal plate body 1 and a second metal plate body 2 are provided, which are made of metal materials with good thermal conductivity such as copper or aluminum, and the first metal plate body 1 and the second metal plate body 2 are plate-shaped , can be formed by a stamping process, the size of the first metal plate body 1 and the second metal plate body 2 is not limited, and can be changed according to needs. The first...
no. 2 example
[0036] see Figure 4 , which is the second embodiment of the present invention, in this embodiment, the capillary structure 3 can be metal powder (such as copper powder), the capillary structure 4 can be a metal mesh (such as copper mesh), capillary structure 3 and 4 It is arranged on opposite sides of the first metal plate body 1 and the second metal plate body 2 .
[0037] Features and functions of the present invention are:
[0038] In the present invention, the first metal plate body 1 and the second metal plate body 2 are bonded and sealed by high-frequency ultrasonic waves, and the capillary structures 3 and 4 and the support structure 5 can also be bonded to the first metal plate body 1 and the second metal plate body by high-frequency ultrasonic waves. 2. Therefore, the manufacturing method of the vapor chamber and the structure of the vapor chamber of the present invention do not require a sintering furnace or a sintering furnace process, and can reduce the traditio...
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