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Vapor chamber manufacturing method and vapor chamber structure

A manufacturing method and vapor chamber technology, applied to lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of long production time, reduce costs, increase production capacity, etc., and achieve the goals of shortening production time, reducing costs, and increasing production capacity Effect

Inactive Publication Date: 2020-05-29
DONGGUAN XIANGLONG HARDWARE PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing vapor chamber must use the diffusion welding process or the laser process, and the diffusion welding equipment needs to use the vacuum hot pressing sintering furnace (referred to as the sintering furnace). The traditional sintering production time is about 8 hours, the production time is too long, and the pass rate is low. Low, difficult to increase capacity and reduce costs

Method used

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  • Vapor chamber manufacturing method and vapor chamber structure
  • Vapor chamber manufacturing method and vapor chamber structure
  • Vapor chamber manufacturing method and vapor chamber structure

Examples

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no. 1 example

[0024] see Figure 1 to Figure 3 , which is a preferred embodiment of the present invention. What needs to be explained first is that this embodiment corresponds to the relevant quantities and shapes mentioned in the drawings, which are only used to specifically illustrate the implementation of the present invention, so as to facilitate understanding of its content , not to limit the protection scope of the present invention.

[0025] The invention provides a method for manufacturing a vapor chamber, comprising the following steps:

[0026] First of all, a first metal plate body 1 and a second metal plate body 2 are provided, which are made of metal materials with good thermal conductivity such as copper or aluminum, and the first metal plate body 1 and the second metal plate body 2 are plate-shaped , can be formed by a stamping process, the size of the first metal plate body 1 and the second metal plate body 2 is not limited, and can be changed according to needs. The first...

no. 2 example

[0036] see Figure 4 , which is the second embodiment of the present invention, in this embodiment, the capillary structure 3 can be metal powder (such as copper powder), the capillary structure 4 can be a metal mesh (such as copper mesh), capillary structure 3 and 4 It is arranged on opposite sides of the first metal plate body 1 and the second metal plate body 2 .

[0037] Features and functions of the present invention are:

[0038] In the present invention, the first metal plate body 1 and the second metal plate body 2 are bonded and sealed by high-frequency ultrasonic waves, and the capillary structures 3 and 4 and the support structure 5 can also be bonded to the first metal plate body 1 and the second metal plate body by high-frequency ultrasonic waves. 2. Therefore, the manufacturing method of the vapor chamber and the structure of the vapor chamber of the present invention do not require a sintering furnace or a sintering furnace process, and can reduce the traditio...

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Abstract

A vapor chamber manufacturing method includes the steps that a first metal plate body and a second metal plate body are provided; at least one of the first metal plate body and the second metal platebody is provided with a capillary structure, and a supporting structure is arranged between the first metal plate body and the second metal plate body; and the first metal plate body and the second metal plate body are correspondingly closed and are jointed through high-frequency ultrasonic waves (with the frequency ranging from 20 KHz to 80 KHz), and a cavity between the first metal plate body and the second metal plate body is vacuumized and filled with working fluid. Therefore, the manufacture procedure conducted by a sintering furnace is not needed, the first metal plate body and the second metal plate body are combined quickly, production capacity is increased, and cost is reduced.

Description

technical field [0001] The invention relates to a method for manufacturing a chamber and a structure for a chamber, in particular to a method for manufacturing a chamber and a structure for providing heat transfer through the circulation of gas and liquid phases. Background technique [0002] The product development of today's technology industry tends to be more sophisticated, such as integrated circuits or computers. In addition to the miniaturization of the volume design, the relative heat generated is also greatly increased, so the heat generated during operation is also considerable. Corresponding radiators or heat dissipation devices are provided for various electronic heating components to maintain their normal operation at a permissible temperature. In addition, heat transfer through heat pipes or vapor chambers is also an application of existing heat dissipation technologies. The principles of both chambers and heat pipes are the same, and both provide heat transfer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/04
Inventor 邱垂宏刘冠昕
Owner DONGGUAN XIANGLONG HARDWARE PROD CO LTD