Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chuck base and semiconductor machining equipment

A technology of semiconductors and chucks, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of misalignment and inclination of workpieces to be processed, and achieve the effects of preventing misalignment or inclination, improving process effects, and improving economic benefits

Active Publication Date: 2020-06-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the shortcomings of the existing methods, the present application proposes a chuck base and semiconductor processing equipment to solve the technical problems of dislocation and inclination of the workpiece to be processed in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chuck base and semiconductor machining equipment
  • Chuck base and semiconductor machining equipment
  • Chuck base and semiconductor machining equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0029] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides a chuck base and semiconductor machining equipment. The chuck base is used for bearing a to-be-processed workpiece in semiconductor equipment and comprises a joint base ring, an insulating ring, an edge ring, a focusing ring and a chuck, wherein the insulating ring is arranged around the outer side of the fixed platform; the edge ring is arranged around theouter side of the insulating ring; the joint base ring is arranged at the tops of the insulating ring and the edge ring; the focusing ring is arranged at the upper part of the joint base ring and surrounds the peripheral edge of the bearing chuck; and the chuck is used for bearing a workpiece to be machined, and the joint base ring is used for damping the chuck. According to the embodiment of theinvention, the vibration source is prevented from disturbing and resonating the chuck and the to-be-machined workpiece on the chuck, so that the to-be-machined workpiece can be prevented from being misplaced or inclined in the process period.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a chuck base and semiconductor processing equipment. Background technique [0002] Currently, etching equipment for integrated circuits plays a critical role in the position of the wafer during the process cycle. During the wafer process cycle, the etching equipment is continuously evacuated or pumped (Pump down / up), the molecular pump and the dry pump are continuously operated at high speed, air-cooled and water-cooled for temperature control, and the Inductive Coupled Plasma Emission Spectrometer (Inductive Coupled Plasma Emission Spectrometer, The ICP) device excites active particles and other working states, forming a multi-coupled vibration source. When the wafer is detached from the chuck, the vibration source formed by the etching equipment will load the wafer, causing the wafer to be misaligned or even defle...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/687
CPCH01L21/68714H01L21/68785
Inventor 王宏伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com