Double-sided heat dissipation device

Abstract

The invention provides a double-sided heat dissipation device, which is used for carrying out double-sided heat dissipation on a flat double-sided heat conduction power device. The double-sided heat dissipation device comprises a flat heat pipe and a water cooling plate, wherein the flat heat pipe comprises an evaporation section and a condensation section, the evaporation section is used for absorbing heat so as to convert a liquid working medium into a gaseous working medium, and the condensation section is used for dissipating heat so as to convert the gaseous working medium into the liquidworking medium; and the water cooling plate comprises a device heat dissipation section and a heat pipe heat dissipation section, the evaporation section of the flat heat pipe and the device heat dissipation section of the water cooling plate are respectively contacted with the two surfaces of the power device to absorb the heat of the power device, and the heat pipe heat dissipation area of thewater cooling plate is contacted with the condensation section of the flat heat pipe to absorb the heat of the condensation section of the flat heat pipe.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a double-sided heat dissipation device for performing double-sided heat dissipation for a flat double-sided heat-conducting power device. Background technique [0002] With the development of integration technology and microelectronic packaging technology, the total power density of electronic components continues to increase, while the physical size of electronic components and electronic equipment tends to be smaller and miniaturized, and the heat generated rapidly accumulates, leading to integration The heat flux around the device is also increasing, so the high temperature environment will definitely affect the performance of electronic components and equipment, which requires a more efficient thermal control scheme. Therefore, the heat dissipation problem of electronic components has evolved into a major focus of current electronic components and electronic equipment manufacturin...

AI Technical Summary

Problems solved by technology

As we all know, due to the one-way flow of the cooling liquid, the water-cooled plate is likely to cause uneven heat dissipation and high local temperature, which is not conducive to the safety of power devices. Therefore, it is necessary to provide a heat dissipation with better temperature uniformity for power devices. Program

[0004] Due to the advantages of light weight, good start-up and temperature uniformity, flat heat pipes have become a hot research direction in the field of heat dissipation of electronic components. At present, they are only used in the field of battery heat dissipation. The common method is to install them between multiple battery plates. A plurality of flat hot plates are sandwiched to dissipate heat for the battery board, but the evaporation section of the multi-piece flat hot plate, that is, the part in contact with the battery board, is used to dissipate heat for the battery board, but at the same time, it is necessary to use other Therefore, for power devices that require strict device size and volume, it is very difficult to specially install a heat sink for the flat plate.

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