A device and method for improving the processing quality of holes with arbitrary angles by changing the laser incident angle

Abstract

The invention discloses a device and method for improving the processing quality of holes with arbitrary angles by changing the laser incident angle, and relates to the field of laser drilling, including a base, a left positioning support plate, an angle control rotating shaft, a workpiece clamping device, bolts, telescopic Clamping device, right positioning support plate, support shaft, rotating shaft, rotating guide rail, gears, positioning fixing bolt holes and rotation unit; the base angle control unit passes through the center of the left support plate and is fixed on the positioning support plate, and the right side is retractable clamp The unit cooperates with the left side to clamp multi-size workpieces. The angle rotation unit is used to precisely adjust the corresponding angle. After the hole machining position is determined, the rotation speed of the lower rotation unit gear is controlled to make the rotation axis rotate continuously and stably along the rotation guide rail. Let the laser have a certain incident angle to process the inner wall of the hole, better remove excess material, improve the processing quality of the inner wall and reduce the taper.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a device and method for improving the processing quality of holes with arbitrary angles by changing the incident angle of laser light. Background technique [0002] Laser drilling is an important application of laser processing technology, involving many fields, such as: aerospace, automotive industry, medical and chemical industries. With the continuous improvement of the processing quality requirements for micro-holes and group holes in these fields, laser drilling will have more and more advantages and status. [0003] Laser drilling has many advantages such as high precision, high efficiency, and no tool loss. However, for holes on high-precision equipment, the requirements for the taper of the hole and the quality of the inner wall are very high. If it is too large, it will reduce the fluidity of the gas inside and directly affect the cooling performance of the gas film hole...

AI Technical Summary

Problems solved by technology

Chinese patent CN20171073269.7 proposes to use a rotatable fixture to rotate the workpiece 180° around the X direction of the hole after the first laser drilling, and perform secondary processing to remove the taper. This method needs to ensure that the center of the processed hole is on the rotation axis X On the other hand, this is unfavorable to the processing of group holes and requires extremely high accuracy of processing and positioning, especially for micro-hole processing, it is difficult to achieve precise positioning

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