Layout structure of efuse

Abstract

The invention provides a layout structure of an efuse. The layout structure of the efuse comprises a middle metal layer of a fuse body, adjacent metal layers respectively distributed above and below the middle metal layer and adjacent to the middle metal layer; wherein the adjacent metal layers are connected with the fuse body on the middle metal layer by through holes; sub-adjacent metal layers respectively distributed above and below the adjacent metal layers, wherein bonding pads are arranged on the sub-adjacent metal layers; and the bonding pads are connected with the adjacent metal layersthrough the through holes. The length of the fuse body in the plane of the middle metal layer is 1.16 microns; the length of the bonding pad in the plane of the sub-adjacent metal layer is 0.32 micron, and the width of the bonding pad in the plane of the sub-adjacent metal layer is 0.15 micron. According to the efuse layout structure adopted by the invention, multiple layers of metal and throughholes among the multiple layers of metal are used for pad layout design, so that an effective heat dissipation area in the vertical direction is formed, the layout area occupied on a plane is reduced,and a relatively good heat dissipation effect can be obtained. Meanwhile, a parallel structure is formed among the multiple layers of metal through the through holes, and the current passing capacitycan be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a layout structure of an efuse fuse. Background technique [0002] Based on the principle of electromigration (EM), eFuse adopts standard CMOS technology and realizes highly reliable on-chip programming function by blowing the fuse. With the increasingly fierce market competition, the requirements for chip area and power consumption are getting higher and higher. As a dedicated module for parameter setting inside the chip, efuse's overall area becomes one of the main design indicators, and the array formed by efuse units occupies more than half of the overall area of ​​efuse. In the efuse unit, the pad part occupies a large area. Therefore, how to reduce the pad area in the efuse unit has become a research object. [0003] Conventional efuse fuses are in the shape of a wine glass and an I-shape. The entire fuse is composed of two parts: the Pad part and the fuse body (l...

AI Technical Summary

Problems solved by technology

[0003] Conventional efuse fuses are wine glass-shaped and I-shaped. The entire fuse is composed of two parts: the Pad part and the fuse body (link). Both are arranged on the same metal layer plane, considering the current capacity and heat dissipation. characteristics, the Pad (pad) part often occupies a larger area

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