Design product structure and method for manufacturing 5G circuit board

Abstract

The invention discloses a design product structure and method for 5G circuit board manufacturing. The design product structure comprises an upper-layer core board, a lower-layer core board and a connecting curing sheet, wherein the upper-layer core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together frombottom to top; the lower-layer core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom totop; wherein the connecting curing sheet is clamped between the upper-layer core plate and the lower-layer core plate, and the first lower copper foil layer and the second upper copper foil layer areboth reverse copper foils and are attached and fixed to the upper surface and the lower surface of the connecting curing sheet respectively. The upper-layer core plate and the lower-layer core plate are adopted, and the lower copper foil layer of the upper-layer core plate and the upper copper foil layer of the lower-layer core plate are both reverse copper foils, so that the surface is relativelyrough, the pressing binding force is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem can be reduced, and the quality of thefinished product is better guaranteed.

Description

technical field [0001] The invention relates to the technology in the field of circuit boards, in particular to a design product structure and method for manufacturing 5G circuit boards. Background technique [0002] At present, 5G products are designed using traditional technology, which has certain disadvantages in pressing bonding force, insulation, and filling. In order to improve this shortcoming, it is first necessary to solve the problem of lamination method and lamination program. At present, the industry mainly uses conventional copper foil sheets (with the light side facing outward), which may cause poor bonding force after lamination, resulting in poor signal transmission and signal interference at the same time when the board is delaminated. Therefore, it is necessary to study a scheme to solve the above problems. Contents of the invention [0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to pro...

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Problems solved by technology

[0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a design product structure and method for manufacturing 5G circuit boards, which can effectively solve the problem of pressing and bonding forces in the existing design product structure. There is a certain missing problem in the signal conduction rate of the finished product

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